MC74VHC1G66DTT1G ON Semiconductor, MC74VHC1G66DTT1G Datasheet - Page 9
![IC SWITCH SPST SOT23-5](/photos/1/38/13881/tsop-5_483_sml.jpg)
MC74VHC1G66DTT1G
Manufacturer Part Number
MC74VHC1G66DTT1G
Description
IC SWITCH SPST SOT23-5
Manufacturer
ON Semiconductor
Series
74VHCr
Type
Analog Switchr
Datasheet
1.MC74VHC1G66DTT1G.pdf
(10 pages)
Specifications of MC74VHC1G66DTT1G
Function
Switch
Circuit
1 x SPST- NO
On-state Resistance
40 Ohm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
2 V ~ 5.5 V
Current - Supply
1µA
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TSOT-23-5, TSOT-5, TSOP-5
Switch Configuration
SPST
On Resistance (max)
60 Ohms
On Time (max)
40 ns
Off Time (max)
40 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Propagation Delay Time
5 ns
Multiplexer Configuration
Single SPST
Number Of Inputs
1
Number Of Outputs
1
Number Of Channels
1
Analog Switch On Resistance
60@3VOhm
Analog Switch Turn On Time
40ns
Analog Switch Turn Off Time
40ns
Package Type
TSOP
Power Supply Requirement
Single
Single Supply Voltage (min)
2V
Single Supply Voltage (typ)
3/5V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Dissipation
200mW
Mounting
Surface Mount
Pin Count
5
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74VHC1G66DTT1GOS
MC74VHC1G66DTT1GOS
MC74VHC1G66DTT1GOSTR
MC74VHC1G66DTT1GOS
MC74VHC1G66DTT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC74VHC1G66DTT1G
Manufacturer:
ON Semiconductor
Quantity:
53 820
Company:
Part Number:
MC74VHC1G66DTT1G
Manufacturer:
ON Semiconductor
Quantity:
9 800
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
MC74VHC1G66, NLVHC1G66
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
TSOP−5, SOT23−5
http://onsemi.com
J
CASE 483−02
K
ISSUE F
0.074
1.9
DETAIL Z
9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
L
S
J
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_