MC74VHC1G66DTT1G ON Semiconductor, MC74VHC1G66DTT1G Datasheet - Page 9

• Manufacturer Part Number: MC74VHC1G66DTT1G
• Description: IC SWITCH SPST SOT23-5
• Manufacturer: ON Semiconductor
• Series: 74VHCr
• Type: Analog Switchr

Specifications of MC74VHC1G66DTT1G

• Function: Switch
• Circuit: 1 x SPST- NO
• On-state Resistance: 40 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 2 V ~ 5.5 V
• Current - Supply: 1µA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-5, TSOT-5, TSOP-5
• Switch Configuration: SPST
• On Resistance (max): 60 Ohms
• On Time (max): 40 ns
• Off Time (max): 40 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Propagation Delay Time: 5 ns
• Multiplexer Configuration: Single SPST
• Number Of Inputs: 1
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 60@3VOhm
• Analog Switch Turn On Time: 40ns
• Analog Switch Turn Off Time: 40ns
• Package Type: TSOP
• Power Supply Requirement: Single
• Single Supply Voltage (min): 2V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 200mW
• Mounting: Surface Mount
• Pin Count: 5
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74VHC1G66DTT1GOS; MC74VHC1G66DTT1GOS; MC74VHC1G66DTT1GOSTR

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
MC74VHC1G66, NLVHC1G66
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
TSOP−5, SOT23−5
http://onsemi.com
J
CASE 483−02
K
ISSUE F
0.074
1.9
DETAIL Z
9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
L
S
J
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_