DC1386B Linear Technology, DC1386B Datasheet - Page 14

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DC1386B

Manufacturer Part Number
DC1386B
Description
BOARD DEMO LTM8032
Manufacturer
Linear Technology
Series
µModuler
Datasheets

Specifications of DC1386B

Design Resources
LTM8032 Spice Model DC1386B Design Files DC1386B Schematic LTM8032 Gerber Files
Main Purpose
DC/DC, Step Down
Outputs And Type
1, Non-Isolated
Power - Output
-
Voltage - Output
3.3V
Current - Output
2A
Voltage - Input
5.5 ~ 36 V
Regulator Topology
Buck
Frequency - Switching
600kHz
Board Type
Fully Populated
Utilized Ic / Part
LTM8032EV
Lead Free Status / Rohs Status
Not applicable / Not applicable
APPLICATIONS INFORMATION
LTM8032
The junction to air and junction to board thermal resistances
given in the Pin Confi guration diagram may also be used
to estimate the LTM8032 internal temperature. These
thermal coeffi cients are determined per JESD 51-9 (JEDEC
standard, test boards for area array surface mount package
thermal measurements) through analysis and physical
correlation. Bear in mind that the actual thermal resistance
of the LTM8032 to the printed circuit board depends upon
the design of the circuit board. The die temperature of
the LTM8032 must be lower than the maximum rating of
125°C, so care should be taken in the layout of the circuit
14
24V SUPPLY
IMPEDANCE
ENERGIZED
Figure 5. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures
Reliable Operation When the LTM8032 is Hot-Plugged to a Live Supply
LOW
+
+
+
SIMULATES HOT PLUG
CLOSING SWITCH
AI.EI.
0.1μF
22μF
35V
STRAY
INDUCTANCE
DUE TO 6 FEET
(2 METERS) OF
TWISTED PAIR
+
0.7Ω
I
IN
4.7μF
4.7μF
4.7μF
V
V
FIN
V
IN
IN
IN
LTM8032
LTM8032
LTM8032
(5a)
(5b)
(5c)
to ensure good heat sinking of the LTM8032.
The bulk of the heat fl ow out of the LTM8032 is through the
bottom of the module and the LGA pads into the printed
circuit board. Consequently a poor printed circuit board
design can cause excessive heating, resulting in impaired
performance or reliability. Please refer to the PCB Layout
section for printed circuit board design suggestions.
Finally, be aware that at high ambient temperatures the
internal Schottky diode will have signifi cant leakage current,
increasing the input quiescent current of the LTM8032.
20V/DIV
10A/DIV
20V/DIV
10A/DIV
20V/DIV
10A/DIV
V
V
V
I
I
I
IN
IN
IN
IN
IN
IN
DANGER
RINGING V
ABSOLUTE MAXIMUM RATING
20μs/DIV
20μs/DIV
20μs/DIV
IN
MAY EXCEED
8032 F05
8032fc

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