PX1012AI-EL1/G,551 NXP Semiconductors, PX1012AI-EL1/G,551 Datasheet
PX1012AI-EL1/G,551
Specifications of PX1012AI-EL1/G,551
935282112551
PX1012AI-EL1/G-S
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PX1012AI-EL1/G,551 Summary of contents
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... The 8-bit data interface operates at 250 MHz with SSTL_2 signaling. The SSTL_2 signaling is compatible with the I/O interfaces available in FPGA products. The PX1011A/1012A PCI Express PHY supports advanced power management functions. The PX1011AI/PX1012AI is for the industrial temperature range ( +85 C). 2. Features 2.1 PCI Express interface I Compliant to PCI Express Base Specifi ...
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Philips Semiconductors 2.3 JTAG interface I JTAG (IEEE 1149.1) boundary scan interface I Built-In Self Test (BIST) controller tests SerDes and I/O blocks at speed I 3.3 V CMOS signaling 2.4 Power management I Dissipates < 300 ...
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... Ordering information Type number Solder process PX1011A-EL1 SnPb solder ball compound PX1011A-EL1/G Pb-free (SnAgCu solder ball compound) PX1011AI-EL1/G Pb-free (SnAgCu solder ball compound) PX1012A-EL1/G Pb-free (SnAgCu solder ball compound) PX1012AI-EL1/G Pb-free (SnAgCu solder ball compound) 5. Marking Table 3. Line Table 4. Line [1] Industrial temperature range. ...
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Philips Semiconductors 6. Block diagram Fig 1. Block diagram PX1011A_PX1012A_2 Product data sheet TXDATA [ 7:0 ] TXCLK RXCLK Ln_TxData0 Ln_TxData1 8b/10b ENCODE PARALLEL TO SERIAL 250 MHz clock CLK GENERATOR TX I/O REFCLK I/O TX_P TX_N REFCLK_P REFCLK_N Rev. ...
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... RXIDLE SS REFCLK_P REFCLK_N RX_P RX_N TX_P TX_N J VREFS Transparent top view. Fig 3. Ball mapping PX1011A_PX1012A_2 Product data sheet PX1011A-EL1 PX1011A-EL1/G PX1011AI-EL1/G PX1012A-EL1/G ball A1 PX1012AI-EL1/G index area Transparent top view RXDATA6 RXDATA4 RXDATA3 RXDATA7 RXDATA5 DDD2 SS DDD2 DDA2 DDA1 V TMS V DDD1 DDD1 ...
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Philips Semiconductors 7.2 Pin description The PHY input and output pins are described in output is defined from the perspective of the PHY. Thus a signal on a pin described as an output is driven by the PHY and a ...
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Philips Semiconductors Table 9. Symbol RXVALID PHYSTATUS RXIDLE RXSTATUS0 RXSTATUS1 RXSTATUS2 Table 10. Symbol TXCLK RXCLK REFCLK_P REFCLK_N PVT VREFS Table 11. Symbol TMS TRST_N TCK TDI TDO PX1011A_PX1012A_2 Product data sheet PXPIPE interface status signals Pin Type Signaling C8 ...
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Philips Semiconductors Table 12. Symbol V DDA1 V DDA2 V DDD1 V DDD2 V DDD3 Functional description The main function of the PHY is to convert digital data into electrical signals and vice versa. The ...
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Philips Semiconductors The de-serializer or Serial-to-Parallel converter (S2P) de-serializes this data into 10-bits parallel data. Since the S2P has no knowledge about the data, the word alignment is still random. This is fixed in the digital domain by the PCS ...
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Philips Semiconductors RESET_N PHYSTATUS Fig 4. Reset 8.5 Power management The power management signals allow the PHY to manage power consumption. The PHY meets all timing constraints provided in the PCI Express base specification regarding clock recovery and link training ...
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Philips Semiconductors Table 13. Summary of power management state PWRDWN[1:0] Power management state 00b P0, normal operation 01b P0s, power saving state 10b P1, lower power state 11b illegal, PHY will enter P1 [1] TXIDLE = 0 [2] TXIDLE = ...
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Philips Semiconductors • The PHY continues to provide the received data on the PXPIPE interface, behaving exactly like normal data reception. • The PHY transitions from normal transmission of data from the PXPIPE interface to looping back the received data ...
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Philips Semiconductors RXDATA[7:0] RXDET_LOOPB TX_P, TX_N Fig 7. Loopback end 8.8 Electrical idle The PCI Express Base Specification requires that devices send an Electrical Idle ordered-set before TX goes to the electrical idle state. The timing diagram of TXCLK TXDATA[7:0] ...
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Philips Semiconductors Table 14 Table 14. PWRDWN[1:0] P0: 00b P0s: 01b P1: 10b 8.9 Clock tolerance compensation The PHY receiver contains an elastic buffer used to compensate for differences in frequencies between bit rates at the two ends of a ...
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Philips Semiconductors RXDATA[7:0] RXSTATUS2, RXSTATUS1, RXSTATUS0 Fig 10. Clock correction - remove a SKP 8.10 Error detection The PHY is responsible for detecting receive errors of several types. These errors are signaled to the MAC layer using the receiver status ...
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Philips Semiconductors 8.10.1 8b/10b decode errors For a detected 8b/10b decode error, the PHY places an EDB (EnD Bad) symbol in the data stream in place of the bad byte, and encodes RXSTATUS with a decode error during the clock ...
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Philips Semiconductors RXDATA[7:0] RXSTATUS2, RXSTATUS1, RXSTATUS0 Fig 13. Elastic buffer underflow For an elastic buffer overflow, the overflow is signaled during the clock cycle where the dropped symbol would have appeared in the data stream. In the timing diagram of ...
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Philips Semiconductors 8.12 Setting negative disparity To set the running disparity to negative, the MAC asserts TXCOMP for one clock cycle that matches with the data that transmitted with negative disparity. TXDATA[7:0] TX_P, TX_N Fig 16. Setting ...
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Philips Semiconductors 9. Limiting values Table 16. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V DDD1 V DDD2 V DDD3 DDA1 V DDA2 V esd T stg amb [1] Human ...
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Philips Semiconductors 11. Characteristics Table 18. PCI Express PHY characteristics Symbol Parameter Supplies V digital supply voltage 1 DDD1 V digital supply voltage 2 DDD2 V digital supply voltage 3 DDD3 V supply voltage DD V analog supply voltage 1 ...
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Philips Semiconductors Table 18. PCI Express PHY characteristics Symbol Parameter Transmitter UI unit interval V differential peak-to-peak output voltage TX_DIFFp-p t maximum time between the jitter median and TX_EYE_m-mJITTER maximum deviation from the median t maximum transmitter jitter time TX_JITTER_MAX ...
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Philips Semiconductors Table 19. PXPIPE characteristics Symbol Parameter f RXCLK frequency RXCLK f TXCLK frequency TXCLK V voltage on pin VREFS VREFS V SSTL_2 HIGH-level output voltage OH(SSTL2) V SSTL_2 LOW-level output voltage OL(SSTL2) V SSTL_2 HIGH-level input voltage IH(SSTL2) ...
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Philips Semiconductors differential Fig 18. Transition eye Fig 19. Non transition eye PX1011A_PX1012A_2 Product data sheet 0.6 0.5 0.4 signal (V) 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.2 0.1 0 0.1 0 ...
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Philips Semiconductors 12. Package outline LFBGA81: plastic low profile fine-pitch ball grid array package; 81 balls; body 1.05 mm ball A1 index area ball A1 index ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not ...
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Philips Semiconductors – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to ...
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Philips Semiconductors [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C body ...
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... T – added industrial temperature range • Table 2 “Ordering PX1012A-EL1/G; added industrial temperature range Type numbers PX1011AI-EL1 and PX1012AI-EL1; added column “Soldering compound” • Figure 1 “Block diagram” • Table – title changed from “Marking” to “Leaded package marking” ...
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Philips Semiconductors Table 24. Revision history …continued Document ID Release date PX1011A_PX1012A_2 20060518 • Modifications: (continued) Table 8 “PXPIPE interface command RXDET_LOOPB, TXIDLE, TXCOMP, and RXPOL • Table 9 “PXPIPE interface status • Table 10 “Clock and reference • Table ...
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Philips Semiconductors Table 24. Revision history …continued Document ID Release date PX1011A_PX1012A_2 20060518 • Modifications: (continued) Section 8.10 “Error – 1st paragraph, 2nd sentence: changed “signals (RXSTATIS2 to RXSTATUS0).” to – 2nd paragraph: changed from “... at the point in ...
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Philips Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...