MT8HTF12864HDZ-800H1 Micron Technology Inc, MT8HTF12864HDZ-800H1 Datasheet
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MT8HTF12864HDZ-800H1
Manufacturer Part Number
MT8HTF12864HDZ-800H1
Description
MODULE DDR2 SDRAM 1GB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r
Specifications of MT8HTF12864HDZ-800H1
Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
800MT/s
Features
-
Package / Case
200-SODIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
DDR2 SDRAM SODIMM
MT8HTF3264HDY – 256MB
MT8HTF6464HDY – 512MB
MT8HTF12864HDY – 1GB
Features
• 200-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
• 256MB (32 Meg x 64), 512MB (64 Meg x 64), or 1GB
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent opera-
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
• Dual rank
Table 1: Key Timing Parameters
PDF: 09005aef80ebed66
htf8c32_64_128x64hd.pdf - Rev. E 3/10 EN
(SODIMM)
PC2-5300, or PC2-6400
(128 Meg x 64)
tion
Speed
Grade
DD
DDSPD
-80E
-800
-667
-53E
-40E
= 1.8V
= 1.7–3.6V
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
t
CK
CL = 6
800
800
–
–
–
256MB, 512MB, 1GB (x64, DR) 200-Pin DDR2 SODIMM
CL = 5
Data Rate (MT/s)
800
667
667
–
–
1
Figure 1: 200-Pin SODIMM (MO-224 R/C A)
Module height: 30mm (1.18in)
CL = 4
Options
• Operating temperature
• Package
• Frequency/CL2
533
533
553
553
400
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin DIMM (lead-free)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-553)
– 5.0ns @ CL = 3 (DDR2-400)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Not recommended for new designs.
CL = 3
400
400
400
400
400
module offerings.
t
(ns)
12.5
RCD
15
15
15
15
A
A
≤ +85°C)
≤ +70°C)
© 2006 Micron Technology, Inc. All rights reserved.
3
3
1
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
-80E
-53E
-40E
-800
-667
(ns)
t
D
55
55
55
55
55
T
Y
RC