NCV8881PWR2G ON Semiconductor, NCV8881PWR2G Datasheet - Page 3

• Manufacturer Part Number: NCV8881PWR2G
• Description: IC SMPS WITH WATCHDOG 16SOIC
• Manufacturer: ON Semiconductor
• Series: -r

Specifications of NCV8881PWR2G

• Topology: Step-Down (Buck) (1), Linear (LDO) (2)
• Function: Automotive
• Number Of Outputs: 3
• Frequency - Switching: 170kHz
• Voltage/current - Output 1: 3.3 V ~ 8 V, 1.5A
• Voltage/current - Output 2: 5V, 100mA
• Voltage/current - Output 3: 8.5V, 40mA
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 5 V ~ 19 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width) Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Specific Notes on Thermal Characterization Conditions:
NOTE:
1. 1 oz. copper, 17.2 mm
2. 1 oz. copper, 645 mm
3. “Board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Min/Max Voltage on WDI
Min/Max Voltage on RDLY
Min/Max Voltage on RESB
Min/Max Voltage on EN
Max EN Current
Min EN Current (with zero VIN voltage)
Min/Max Voltage on SYNC
Min/Max Voltage on ROSC
Min/Max Voltage COMP
Min/Max Voltage FB
Min Voltage SW
Max Voltage VIN to SW
Max Voltage VIN
Min/Max Voltage BST
Min/Max Voltage BST to SW
Min/Max Voltage on 8P5
Max 8P5 Current
Min/Max Voltage on LDOMON
Min/Max Voltage on 5P0
Min/Max Voltage IGNBUF
Storage Temperature range
Operating Junction Temperature Range
ESD withstand Voltage Human Body Model
Moisture Sensitivity
Peak Reflow Soldering Temperature
Junction−to−case top (Y
Junction−to−pin 1(Y
Junction−to−board (Y
Junction−to−ambient (R
best represents the primary heat flow path and is least sensitive to board and ambient properties.
All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions.
Numerical values are derived from an axisymmetric finite−element model where active die area, total die area, flag area, pad area,
and board area are equated to the actual corresponding areas.
JL1
JB
2
, q
2
qJA
, q
JT
(1 in
spreader area (minimum exposed pad, not including traces which are assumed).
JL1
Parameter
, q
JB
, q
Rating
) (Note 3)
JT
)
2
JA
) spreader area (includes exposed pad).
)
)
Charged Device Model
Machine Model
http://onsemi.com
− 20 ns
– DC
3
Symbol
V
Minimum Pad (Note 1)
MSL
T
ESD
J
Board/Mounting Conditions Typical Value
150
30
70
15
−40 to + 150
−55 to +150
−0.3 to 9.5
−0.3 to 10
−0.3 to 30
−0.3 to 15
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
−0.3 to 7
Level 1
Value
−0.7
>1.0
−10
200
260
2.0
10
−3
40
40
70
1 sq. inch (Note 2)
16
65
17
55
°C/W
°C/W
°C/W
°C/W
Unit
Unit
mA
mA
mA
°C
°C
kV
kV
°C
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V