PX1011BI-EL1/G,551 NXP Semiconductors, PX1011BI-EL1/G,551 Datasheet - Page 19

IC PCI-EXPRESS X1 PHY 81-LFBGA

PX1011BI-EL1/G,551

Manufacturer Part Number
PX1011BI-EL1/G,551
Description
IC PCI-EXPRESS X1 PHY 81-LFBGA
Manufacturer
NXP Semiconductors
Datasheets

Specifications of PX1011BI-EL1/G,551

Package / Case
81-LFBGA
Applications
PCI Express MAX to PCI Express PHY
Interface
JTAG
Voltage - Supply
1.2 V
Mounting Type
Surface Mount
Input Voltage Range (max)
0.31 V
Maximum Operating Temperature
+ 85 C
Maximum Power Dissipation
300 mW
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
1.2 V
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935282114551
PX1011BI-EL1/G-S
PX1011BI-EL1/G-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PX1011BI-EL1/G,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Limiting values
10. Thermal characteristics
PX1011B
Product data sheet
Table 16.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 17.
[1]
Symbol
V
T
Symbol
R
R
V
V
V
V
V
V
T
T
stg
j
amb
DDD1
DDD2
DDD3
DD
DDA1
DDA2
ESD
th(j-a)
th(j-c)
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model -
Component level; Electrostatic Discharge Association, Rome, NY, USA.
Charged Device Model: ANSI/EOS/ESD-S5.3.1-1999, standard for ESD sensitivity testing, Charged Device
Model - component level; Electrostatic Discharge Association, Rome, NY, USA.
Significant variations can be expected due to system variables, such as adjacent devices, or actual air flow
across the package.
Parameter
digital supply voltage 1
digital supply voltage 2
digital supply voltage 3
supply voltage
analog supply voltage 1
analog supply voltage 2
electrostatic discharge voltage
storage temperature
junction temperature
ambient temperature
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
Limiting values
Thermal characteristics
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 April 2011
operating
Conditions
for JTAG I/O
for SSTL_2 I/O
for core
for high-speed
serial I/O and PVT
for serializer
for serializer
HBM
CDM
commercial
industrial
Conditions
in free air
in free air
PCI Express stand-alone X1 PHY
[1]
[2]
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−55
−55
0
−40
[1]
[1]
PX1011B
© NXP B.V. 2011. All rights reserved.
Typ
44
10
Max
+4.6
+3.75
+1.7
+1.7
+1.7
+4.6
2000
500
+150
+125
+70
+85
Unit
K/W
K/W
19 of 32
Unit
V
V
V
V
V
V
V
V
°C
°C
°C
°C

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