UJA1065TW/5V0/512 NXP Semiconductors, UJA1065TW/5V0/512 Datasheet - Page 68
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
UJA1065TW/5V0/512
Manufacturer Part Number
UJA1065TW/5V0/512
Description
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065TW3V3CT.pdf
(76 pages)
Specifications of UJA1065TW/5V0/512
Applications
*
Interface
*
Voltage - Supply
*
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935288868512
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NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
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A
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