DS90LV001TMX/NOPB National Semiconductor, DS90LV001TMX/NOPB Datasheet - Page 6

• Manufacturer Part Number: DS90LV001TMX/NOPB
• Description: IC BUFFER LVDS/LVDS 3.3V 8-SOIC
• Manufacturer: National Semiconductor
• Type: Bufferr

Specifications of DS90LV001TMX/NOPB

• Tx/rx Type: LVDS
• Delay Time: 2.0ns
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 70mA
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• For Use With: LVDS001EVK - BOARD EVALUATION DS90LV001
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance - Input: -
• Other names: DS90LV001TMX

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DS90LV001 Pin Descriptions (SOIC and LLP)
Typical Applications
Backplane Stub-Hider Application
Pin Name
OUT -
OUT+
GND
DAP
IN −
V
IN+
NC
EN
CC
Pin #
NA
1
2
3
4
5
6
7
8
Input/Output
NA
O
O
P
P
I
I
I
Ground
Inverting receiver LVDS input pin
Non-inverting receiver LVDS input pin
No Connect
Power Supply, 3.3V ± 0.3V.
Non-inverting driver LVDS output pin
Inverting driver LVDS output pin
Enable pin. When EN is LOW, the driver is disabled and the LVDS
outputs are in TRI-STATE. When EN is HIGH, the driver is enabled.
LVCMOS/LVTTL levels.
Die Attach Pad or DAP (LLP Package only). The DAP is NOT connected
to the device GND nor any other pin. It is still recommended to connect
the DAP to a GND plane of a PCB for enhenced heat dissipation.
6
Description
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