PCA9517AD,118 NXP Semiconductors, PCA9517AD,118 Datasheet
PCA9517AD,118
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PCA9517AD,118 Summary of contents
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PCA9517A Level translating I Rev. 02 — 5 May 2008 1. General description The PCA9517A is a CMOS integrated circuit that provides level shifting between low voltage (down to 0.9 V) and higher voltage (2 5 ...
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... NXP Semiconductors 2. Features I 2 channel, bidirectional buffer isolates capacitance and allows 400 pF on either side of the device I Voltage level translation from 0 5.5 V and from 2 5 Footprint and functional replacement for PCA9515/15A C-bus and SMBus compatible I Active HIGH repeater enable input I Open-drain input/outputs ...
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... NXP Semiconductors 4. Functional diagram Fig 1. 5. Pinning information 5.1 Pinning V Fig 2. 5.2 Pin description Table 3. Symbol V CC(A) SCLA SDAA GND EN SDAB SCLB V CC(B) PCA9517A_2 Product data sheet V CC(A) PCA9517A SDAA SCLA V CC(B) pull-up resistor EN Functional diagram of PCA9517A CC(A) CC(B) SCLA 2 7 SCLB ...
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... NXP Semiconductors 6. Functional description Refer to The PCA9517A enables I without degradation of system performance. The PCA9517A contains two bidirectional open-drain buffers specifically designed to support up-translation/down-translation between the low voltage (as low as 0.9 V) and a 3 and I/Os are overvoltage tolerant to 5.5 V even when the device is unpowered (V ...
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... NXP Semiconductors 7. Application design-in information A typical application is shown 3 Master devices can be placed on either bus. Fig 4. The PCA9517A tolerant does not require any additional circuitry to translate between 0 5.5 V bus voltages and 2 5.5 V bus voltages. When port A of the PCA9517A is pulled LOW by a driver on the I detects the falling edge when it goes below 0 ...
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... NXP Semiconductors Fig SDAA SDA SCLA SCL BUS PCA9517A MASTER EN Fig 6. Typical series application PCA9517A_2 Product data sheet V CC( SDA SCL BUS MASTER Typical star application SDAB SDAA SDAB SCLB SCLA SCLB PCA9517A EN Rev. 02 — 5 May 2008 PCA9517A Level translating I V CC(B) ...
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... NXP Semiconductors Fig 7. SCL SDA Fig 8. SCL SDA Fig 9. PCA9517A_2 Product data sheet CARD 1 CARD Typical application of PCA9517A driving a short cable 9th clock pulse acknowledge Bus A (0 5.5 V bus) waveform 9th clock pulse acknowledge V of slave OL Bus B (2 5.5 V) waveform Rev. 02 — 5 May 2008 ...
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... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage port B CC(B) V supply voltage port A CC(A) V voltage on an input/output pin I/O I input/output current I/O I input current I P total power dissipation tot ...
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... NXP Semiconductors 9. Static characteristics Table 5. Static characteristics 5.5 V; GND = Symbol Parameter Supplies V supply voltage port B CC(B) V supply voltage port A CC(A) I supply current on pin V CC(VCC(A)) I HIGH-level supply current CCH I LOW-level supply current CCL I contention port A supply current CC(A)c Input and output SDAB and SCLB ...
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... NXP Semiconductors Table 5. Static characteristics 5.5 V; GND = Symbol Parameter Enable V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level input current on IL(EN) pin EN I input leakage current LI C input capacitance i [1] LOW-level supply voltage. [2] V specification is for the first LOW level seen by the SDAB/SCLB lines SDAB/SCLB lines ...
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... NXP Semiconductors 10.1 AC waveforms input 1 PHL 80 % 0.6 V output THL Fig 10. Propagation delay and transition times; port B to port A Fig 12. Propagation delay 11. Test information Fig 13. Test circuit for open-drain outputs PCA9517A_2 Product data sheet 3.0 V 1 PLH 1 0 TLH 002aad642 Fig 11. Propagation delay and transition times; ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 9. Acronym CDM CMOS ESD HBM 2 I C-bus MM RC SMBus PCA9517A_2 Product data sheet ...
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... NXP Semiconductors 15. Revision history Table 10. Revision history Document ID Release date PCA9517A_2 20080505 • Modifications: Table 1 “PCA9517 and PCA9517A – changed HBM for PCA9517A from “> 6.5 kV” to “>5.5 kV” – changed MM for PCA9517A from “> 550 V” to “> 450 V” ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Enable 6.2 I C-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application design-in information . . . . . . . . . . 5 8 Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . 10 10.1 AC waveforms ...