PCA9517AD,112 NXP Semiconductors, PCA9517AD,112 Datasheet - Page 15
![IC I2C BUS REPEATER 8-SOIC](/photos/5/44/54425/568-8-soic_sot96-1_sml.jpg)
PCA9517AD,112
Manufacturer Part Number
PCA9517AD,112
Description
IC I2C BUS REPEATER 8-SOIC
Manufacturer
NXP Semiconductors
Type
Repeaterr
Datasheet
1.PCA9517AD112.pdf
(19 pages)
Specifications of PCA9517AD,112
Tx/rx Type
I²C Logic
Delay Time
170ns
Capacitance - Input
6pF
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
5mA
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935285763112
PCA9517AD
PCA9517AD
PCA9517AD
PCA9517AD
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCA9517AD,112
Manufacturer:
NXP
Quantity:
12 000
NXP Semiconductors
PCA9517A_2
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
16.
Rev. 02 — 5 May 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
16) than a SnPb process, thus
Level translating I
220
220
350
PCA9517A
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
2
C-bus repeater
15 of 19