CYV15G0204RB-BGXC Cypress Semiconductor Corp, CYV15G0204RB-BGXC Datasheet - Page 23

• Manufacturer Part Number: CYV15G0204RB-BGXC
• Description: IC DESERIAL HOTLINK 256LBGA
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYV15G0204RB-BGXC

• Function: Deserializer
• Data Rate: 1.485Gbps
• Input Type: PECL
• Output Type: LVTTL
• Number Of Inputs: 2
• Number Of Outputs: 2
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA Exposed Pad, 32-HLBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
Package Diagram
HOTLink is a registered trademark and HOTLink II and MultiFrame are trademarks of Cypress Semiconductor. All product and
company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-02103 Rev. *C
© Cypress Semiconductor Corporation, 2002-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Standard
Standard
A1 CORNER I.D.
Speed
C
CYV15G0204RB-BGC
CYV15G0204RB-BGXC
1.57±0.175
0.60±0.10
0.97 REF.
Ordering Code
SIDE VIEW
TOP VIEW
27.00±0.13
Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
Package
SEATING PLANE
BL256
BL256
Name
A
0.20(4X)
256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
0.15
B
0.15
C
C
Ø0.75±0.15(256X)
Ø0.15 M C
Ø0.30 M C
Package Type
A
A
B
0.50 MIN.
BOTTOM VIEW (BALL SIDE)
20
19
18
17
16
15
14
SECTION A-A
13
R 2.5 Max (4X)
12
24.13
A
11
10
9
CYV15G0204RB
8
7
6
5
TOP OF MOLD COMPOUND
TO TOP OF BALLS
4
0.20 MIN
3
2
1
Commercial
Commercial
51-85123-*E
W
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Y
Page 23 of 24
Operating
Range
A1 CORNER I.D.
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