NUR460,133 NXP Semiconductors, NUR460,133 Datasheet - Page 3

• Manufacturer Part Number: NUR460,133
• Description: DIODE HI SPEED SWITCHING SOD141
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of NUR460,133

• Voltage - Forward (vf) (max) @ If: 1.28V @ 4A
• Voltage - Dc Reverse (vr) (max): 600V
• Current - Average Rectified (io): 4A
• Current - Reverse Leakage @ Vr: 50µA @ 600V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 65ns
• Capacitance @ Vr, F: -
• Mounting Type: *
• Package / Case: *
• Product: Power Diodes
• Peak Reverse Voltage: 600 V
• Forward Continuous Current: 4 A
• Max Surge Current: 8 A
• Configuration: Single
• Recovery Time: 33 ns
• Forward Voltage Drop: 1.28 V
• Maximum Reverse Leakage Current: 50 uA
• Mounting Style: Axial
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6882-3

Date: 2011-05-20
1.
suitable for assembly in DO-201A(SOD141) package at GoodArk sub-contractor. This is a new
process flow for DJLN but solderable front metal has been used on devices manufactured at the
Manchester bipolar waferfab some years earlier. The basis of the process flow was the glass
passivated BYV25-600 and all trials used this mask set and settings from the standard process flow
where possible. It is assembled in Suzhou Goodark’s Axial lead product line.
Hi-tech Industry District, west side of SuZhou. GoodArk package family covers Axial lead, SMx,
Mini-Bridge, TO220 family and QFN.
BOM.
2.
PL Bipolar
NXP Semiconductors
Assembly Operations
Lead Wire
Bare copper
1,21mm
SHANGHAI
SHANXIN
This qualification report is to release SOD141 package which will be used for product NUR460.
The NUR460 process flow is designed to give a 300um thick epi diode with solderable front metal
GoodArk had got ISO9000, ISO14000, QS9000,OHSAS18000,TS16949 certification.
GoodArk is a leading company to produce Diodes and Rectifier in China. The factory is located in
Regarding to this SOD141 package qualification, we use GoodArk standard Axial lead process and
Material details
Assembly material
Introduction
Solder chip
Pb92.5Sn5Ag2.5
CoiningMartin
Oud
Coining
Author: Brian Xie
NUR460/SOD141 package releasing in
Molding compound
EME-110G Halogen
free Sumikon
Self Qualification Report:
subcontractor GoodArk
Plating
Pure Tin
YUNNAN TIN
UV ink, Grey, Bon Mark
Page: 3
Document Number
Marking Ink
1410
Revision: 01