PCA9555DB,112 NXP Semiconductors, PCA9555DB,112 Datasheet - Page 31

• Manufacturer Part Number: PCA9555DB,112
• Description: IC I/O EXPANDER I2C 16B 24SSOP
• Manufacturer: NXP Semiconductors

Specifications of PCA9555DB,112

• Package / Case: 24-SSOP
• Interface: I²C, SMBus
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCA9555
• Number Of Lines (input / Output): 16.0 / 16.0
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 200 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 5 V
• Logic Type: I2C, SMBus
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 16.0
• Number Of Output Lines: 16.0
• Output Current: 50 mA
• Output Voltage: 5 V
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SSOP
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-5027; 935269568112; PCA9555DB; PCA9555DB,112; PCA9555DB

NXP Semiconductors
17. Abbreviations
PCA9555_8
Product data sheet
16.4 Package related soldering information
Table 18.
[1]
[2]
Table 19.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CMOS
GPIO
I
SMBus
I/O
ACPI
LED
ESD
HBM
MM
CDM
PCB
FET
MSB
LSB
2
C-bus
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Complementary Metal Oxide Semiconductor
General Purpose Input/Output
Inter-Integrated Circuit bus
System Management Bus
Input/Output
Advanced Configuration and Power Interface
Light Emitting Diode
ElectroStatic Discharge
Human Body Model
Machine Model
Charged Device Model
Printed-Circuit Board
Field-Effect Transistor
Most Significant Bit
Least Significant Bit
Rev. 08 — 22 October 2009
16-bit I
Soldering method
Dipping
-
suitable
-
2
C-bus and SMBus I/O port with interrupt
Wave
suitable
suitable
not suitable
PCA9555
© NXP B.V. 2009. All rights reserved.
[1]
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