PCF8574TS/3,112 NXP Semiconductors, PCF8574TS/3,112 Datasheet - Page 2
![IC I/O EXPANDER I2C 8B 20SSOP](/photos/6/63/66383/20-ssop_sot266-1_sml.jpg)
PCF8574TS/3,112
Manufacturer Part Number
PCF8574TS/3,112
Description
IC I/O EXPANDER I2C 8B 20SSOP
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8574ATS3118.pdf
(24 pages)
Specifications of PCF8574TS/3,112
Package / Case
20-SSOP
Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
100KHz
Voltage - Supply
2.5 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Includes
POR
Maximum Operating Frequency
100 KHz
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Output Lines
9
Output Voltage
2.4 V
Supply Voltage (max)
6 V
Supply Voltage (min)
2.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-3615 - DEMO BOARD I2C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3988-5
935275672112
PCF8574TDK
PCF8574TDK
935275672112
PCF8574TDK
PCF8574TDK
Philips Semiconductors
CONTENTS
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
8
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
13.3.1
13.3.2
13.3.3
13.4
14
15
16
17
2002 Nov 22
Remote 8-bit I/O expander for I
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
DIP16 and SO16 packages
SSOP20 package
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
FUNCTIONAL DESCRIPTION
Addressing
Interrupt output
Quasi-bidirectional I/Os
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
PACKAGE OUTLINES
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-BUS TIMING CHARACTERISTICS
2
C COMPONENTS
2
C-BUS
2
C-bus
2
Product specification
PCF8574