MCP2122-E/SN Microchip Technology, MCP2122-E/SN Datasheet - Page 37

• Manufacturer Part Number: MCP2122-E/SN
• Description: IC ENCODER/DECODER IRDA 8SOIC
• Manufacturer: Microchip Technology
• Type: Infrared Encoder/Decoderr

Specifications of MCP2122-E/SN

• Package / Case: 8-SOIC (3.9mm Width)
• Applications: Data-Logging, Data Exchange
• Voltage - Supply, Analog: 1.8 V ~ 5.5 V
• Voltage - Supply, Digital: 1.8 V ~ 5.5 V
• Mounting Type: Surface Mount
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Ic Function: Encoder / Decoder IC
• Supply Voltage Range: 1.8V To 5.5V
• Operating Temperature Range: -40°C To +125°C
• Digital Ic Case Style: SOIC
• No. Of Pins: 8
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP212XDM - BOARD DEVELOPMENT IRDA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP2122-E/SNG; MCP2122-E/SNG

A.1
© 2009 Microchip Technology Inc.
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some schematics and
board layouts may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2120/22
Developer’s Board:
• Board - Schematic
• Board - Top Silk and Pads
• Board - Top layer plus Silk and Pads
• Board - Bottom Layer
• Board - V
• Board - Ground Layer
The layer order is shown in Figure A-1.
FIGURE A-1:
Appendix A. Schematic and Layouts
DD
NOTICE TO CUSTOMERS
Layer
MCP2120/22 DEVELOPER’S BOARD
LAYER ORDER
Top Layer
Ground Layer
Power Layer
Bottom Layer
USER’S GUIDE
DS51842A-page 33