MCP2122-E/SN Microchip Technology, MCP2122-E/SN Datasheet - Page 3

• Manufacturer Part Number: MCP2122-E/SN
• Description: IC ENCODER/DECODER IRDA 8SOIC
• Manufacturer: Microchip Technology
• Type: Infrared Encoder/Decoderr

Specifications of MCP2122-E/SN

• Package / Case: 8-SOIC (3.9mm Width)
• Applications: Data-Logging, Data Exchange
• Voltage - Supply, Analog: 1.8 V ~ 5.5 V
• Voltage - Supply, Digital: 1.8 V ~ 5.5 V
• Mounting Type: Surface Mount
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Ic Function: Encoder / Decoder IC
• Supply Voltage Range: 1.8V To 5.5V
• Operating Temperature Range: -40°C To +125°C
• Digital Ic Case Style: SOIC
• No. Of Pins: 8
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP212XDM - BOARD DEVELOPMENT IRDA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP2122-E/SNG; MCP2122-E/SNG

Preface ........................................................................................................................... 1
Chapter 1. Product Overview ....................................................................................... 5
Chapter 2. Installation and Operation ....................................................................... 15
Appendix A. Schematic and Layouts ........................................................................ 33
Appendix B. Bill Of Materials (BOM) ......................................................................... 41
Appendix C. Board Testing ........................................................................................ 45
Appendix D. Configuring the HyperTerminal
Appendix E. Continously Transmitted Data Table ................................................... 51
Appendix F. Programming the MCP212XDM ............................................................ 53
Worldwide Sales and Service .................................................................................... 54
© 2009 Microchip Technology Inc.
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 2
Conventions Used in this Guide ............................................................................ 3
Recommended Reading........................................................................................ 4
The Microchip Web Site ........................................................................................ 4
Customer Support ................................................................................................. 4
Document Revision History ................................................................................... 4
1.1 Introduction And Highlights ............................................................................ 5
1.2 What is the MCP2120/22 Developer’s Board? ............................................... 5
1.3 MCP2120/22 Developer’s Board Features ..................................................... 6
1.4 PC Requirements ......................................................................................... 14
1.5 What the MCP2120/22 Developer’s Board Kit includes: .............................. 14
2.1 Introduction ................................................................................................... 15
2.2 The Demo System ........................................................................................ 16
2.3 MCP212XDM Demos ................................................................................... 20
A.1 Introduction .................................................................................................. 33
A.2 Board - Schematic ....................................................................................... 34
A.3 Board - Top Silk and Pads
A.4 Board - Top Layer plus Silk and Pads
A.5 Board - Bottom Layer ................................................................................. 37
A.6 Board - Power Layer ................................................................................... 38
A.7 Board - Ground Layer ................................................................................ 39
C.1 What is Tested ............................................................................................. 45
C.2 What is NOT Tested .................................................................................... 45
D.1 Configuring the Hyperterminal® Program .................................................... 47
MCP2120/22 DEVELOPER’S BOARD
Table of Contents
........................................................................ 35
®
Program ......................................... 47
...................................................... 36
USER’S GUIDE
DS51842A-page iii