LPC1833FET256,551 NXP Semiconductors, LPC1833FET256,551 Datasheet - Page 83

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LPC1833FET256,551

Manufacturer Part Number
LPC1833FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr

Specifications of LPC1833FET256,551

Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
 Details
Other names
935293791551
NXP Semiconductors
16. Revision history
Table 25.
LPC1850_30_20_10
Objective data sheet
Document ID
LPC1850_30_20_10 v.1.2
Modifications:
LPC1850_30_20_10 v.1
Revision history
Release date Data sheet status
20110217
20110103
RMII removed from description of pin functions ENET_RXD2, ENET_RXD3,
ENET_ER. ENET_REF_CLK removed from pin function ENET_RX_CLK
Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2)
added
All pins with default state n.c. are inputs with pull-ups enabled on reset
SPIFI functions removed from pins PA_0, PA_3, PC_4, PC_5, PC_8, PE_2 in
Reset states added for multiple pins in
Editorial updates.
Section 13.2 “Crystal oscillator”
Pin P2_7 designated as boot pin 3 in
USB0 and USB1 added to boot sources in
All information provided in this document is subject to legal disclaimers.
(Section 2
Rev. 1.2 — 17 February 2011
Objective data sheet
Objective data sheet
and
Section
7.12.9).
added.
Table
Table
-
-
Change notice Supersedes
32-bit ARM Cortex-M3 microcontroller
Table 4
3.
LPC1850/30/20/10
3.
and
Table
LPC1850_30_20_10 v.1
-
5.
© NXP B.V. 2011. All rights reserved.
(Table
(Table
Table
3).
83 of 87
3).
3.

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