MAXQ2000-QAX Maxim Integrated Products, MAXQ2000-QAX Datasheet - Page 13
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MAXQ2000-QAX
Manufacturer Part Number
MAXQ2000-QAX
Description
Microcontrollers (MCU) Low-Power LCD MCU
Manufacturer
Maxim Integrated Products
Datasheet
1.MAXQ2000-RAX.pdf
(38 pages)
Specifications of MAXQ2000-QAX
Processor Series
MAXQ2000
Core
RISC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
2 KB
Interface Type
1-Wire, SPI, JTAG, UART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
50
Number Of Timers
3
Operating Supply Voltage
1.8 V to 2.75 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-68
Development Tools By Supplier
MAXQ2000-KIT
Minimum Operating Temperature
- 40 C
The following is an introduction to the primary features
of the microcontroller. More detailed descriptions of the
device features can be found in the data sheets, errata
sheets, and user’s guides described later in the
Additional Documentation section.
The MAXQ2000 is a low-cost, high-performance,
CMOS, fully static, 16-bit RISC microcontroller with flash
memory and an integrated 100- or 132-segment LCD
controller. It is structured on a highly advanced, accu-
mulator-based, 16-bit RISC architecture. Fetch and exe-
cution operations are completed in one cycle without
pipelining, because the instruction contains both the op
code and data. The result is a streamlined 20 million
instructions-per-second (MIPS) microcontroller.
The highly efficient core is supported by a 16-level
hardware stack, enabling fast subroutine calling and
task switching. Data can be quickly and efficiently
manipulated with three internal data pointers. Multiple
data pointers allow more than one function to access
data memory without having to save and restore data
pointers each time. The data pointers can automatically
increment or decrement following an operation, elimi-
nating the need for software intervention. As a result,
application speed is greatly increased.
The instruction set is composed of fixed-length, 16-bit
instructions that operate on registers and memory loca-
tions. The instruction set is highly orthogonal, allowing
arithmetic and logical operations to use any register
along with the accumulator. Special-function registers
control the peripherals and are subdivided into register
modules. The family architecture is modular, so that
new devices and modules can reuse code developed
for existing products.
The architecture is transport-triggered. This means that
writes or reads from certain register locations can also
cause side effects to occur. These side effects form the
basis for the higher-level op codes defined by the
assembler, such as ADDC, OR, JUMP, etc. The op
codes are actually implemented as MOVE instructions
between certain register locations, while the assembler
handles the encoding, which need not be a concern to
the programmer.
The 16-bit instruction word is designed for efficient exe-
cution. Bit 15 indicates the format for the source field of
the instruction. Bits 0 to 7 of the instruction represent the
source for the transfer. Depending on the value of the
MAXQ Core Architecture
Detailed Description
Instruction Set
____________________________________________________________________
Low-Power LCD Microcontroller
format field, this can either be an immediate value or a
source register. If this field represents a register, the
lower four bits contain the module specifier and the
upper four bits contain the register index in that module.
Bits 8 to 14 represent the destination for the transfer.
This value always represents a destination register, with
the lower four bits containing the module specifier and
the upper three bits containing the register subindex
within that module. Any time that it is necessary to
directly select one of the upper 24 registers as a desti-
nation, the prefix register, PFX, is needed to supply the
extra destination bits. This prefix register write is insert-
ed automatically by the assembler and requires only
one additional execution cycle.
The device incorporates several memory areas:
• 4kB utility ROM,
• 32kWords of flash memory for program storage,
• 1kWord of SRAM for storage of temporary variables, and
• 16-level stack memory for storage of program return
The memory is arranged by default in a Harvard archi-
tecture, with separate address spaces for program and
data memory. A special mode allows data memory to be
mapped into program space, permitting code execution
from data memory. In addition, another mode allows pro-
gram memory to be mapped into data space, permitting
code constants to be accessed as data memory.
The incorporation of flash memory allows the devices to
be reprogrammed, eliminating the expense of throwing
away one-time programmable devices during develop-
ment and field upgrades. Flash memory can be pass-
word protected with a 16-word key, denying access to
program memory by unauthorized individuals.
A pseudo-Von Neumann memory map can also be
enabled. This places the utility ROM, code, and data
memory into a single contiguous memory map. This is
useful for applications that require dynamic program
modification or unique memory configurations.
A 16-bit-wide internal stack provides storage for pro-
gram return addresses and general-purpose use. The
stack is used automatically by the processor when the
CALL, RET, and RETI instructions are executed and
interrupts serviced. The stack can also be used explic-
itly to store and retrieve data by using the PUSH, POP,
and POPI instructions.
addresses and general-purpose use.
Memory Organization
Stack Memory
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