AT24C16C-XHM-B Atmel, AT24C16C-XHM-B Datasheet - Page 19

• Manufacturer Part Number: AT24C16C-XHM-B
• Manufacturer: Atmel

Specifications of AT24C16C-XHM-B

• Lead Free Status / Rohs Status: Compliant

8719A–SEEPR–9/10
8Y6 – Mini Map
Notes: 1. This drawing is for general information only. Refer to
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Package Drawing Contact:
2. Dimension b applies to metallized terminal and is
3. Soldering the large thermal pad is optional, but not
JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimension should not be
measured in that radius area.
recommended.
accomplished to the device through this pad, so if
soldered it should be tied to ground
D
Pin 1
Index
Area
No
electrical
TITLE
8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
A3
A2
connection
A
A1
is
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
1.50 REF.
COMMON DIMENSIONS
e (6X)
(Unit of Measure = mm)
1.40
0.00
0.20
0.20
MIN
D2
–
–
–
Atmel AT24C16C
GPC
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
YNZ
NOM
1.50
0.02
0.30
0.25
–
–
–
DRAWING NO.
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
8Y6
(8X)
Pin 1 ID
b
L (8X)
NOTE
2
11/21/08
REV.
E
19