LLL153C80J224ME14E Murata Electronics North America, LLL153C80J224ME14E Datasheet - Page 212

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LLL153C80J224ME14E

Manufacturer Part Number
LLL153C80J224ME14E
Description
CAP CER
Manufacturer
Murata Electronics North America
Series
LLLr
Datasheet

Specifications of LLL153C80J224ME14E

Capacitance
0.22µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X6S
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 105°C
Applications
Bypass, Decoupling
Ratings
-
Package / Case
-
Size / Dimension
-
Height
-
Thickness
-
Lead Spacing
-
Features
Low ESL (Reverse Geometry)
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
LLL153C80J224ME14L
LLL153C80J224ME14L

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LLL153C80J224ME14E
Manufacturer:
MURATA
Quantity:
640 000
Part Number:
LLL153C80J224ME14E
Manufacturer:
Murata
Quantity:
20 000
18
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
210
!Caution
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Example
to be avoided>
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Examples
of improvements>
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
It is possible for the chip to crack by the expansion and
shrinkage of a metal board.
Please contact us if you want to use our ceramic
capacitors on a metal board such as Aluminum.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C02E.pdf
09.9.18

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