LLL153C80J224ME14E Murata Electronics North America, LLL153C80J224ME14E Datasheet - Page 158

• Manufacturer Part Number: LLL153C80J224ME14E
• Description: CAP CER
• Manufacturer: Murata Electronics North America
• Series: LLLr

Specifications of LLL153C80J224ME14E

• Capacitance: 0.22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Applications: Bypass, Decoupling
• Ratings: -
• Package / Case: -
• Size / Dimension: -
• Height: -
• Thickness: -
• Lead Spacing: -
• Features: Low ESL (Reverse Geometry)
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: LLL153C80J224ME14L; LLL153C80J224ME14L

8
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
4. Flux Application
1. An excessive amount of flux generates a large quantity of
2. Flux containing too a high percentage of halide may
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
2. Unsuitable cleaning solvent may leave residual flux, other
156
Notice
Notice
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
flux gas, which can cause a deterioration of Solderability.
So apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering).
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.2%
max.
and condition surely for confirming the quality and select
the applicable solvent.
foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
3. Select the proper cleaning conditions.
[As a Single Chip]
[As Mounted on Substrate]
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
B
C
A
Continued on the following page.
B
A
D
Outer Electrode
C02E.pdf
09.9.18