LTC2934ITS8-1#PBF Linear Technology, LTC2934ITS8-1#PBF Datasheet - Page 10

• Manufacturer Part Number: LTC2934ITS8-1#PBF
• Manufacturer: Linear Technology

Specifications of LTC2934ITS8-1#PBF

• Lead Free Status / Rohs Status: Compliant

LTC2934
PACKAGE DESCRIPTION
10
2.55 ±0.05
1.15 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
0.64 ±0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
1.37 ±0.05
(2 SIDES)
(Reference LTC DWG # 05-08-1719 Rev Ø)
8-Lead Plastic DFN (2mm × 2mm)
0.45 BSC
0.75 ±0.05
0.70 ±0.05
0.25 ± 0.05
2.00 ±0.10
DC Package
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
R = 0.05
0.64 ± 0.10
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
4
TYP
5
1.37 ±0.10
(2 SIDES)
8
0.45 BSC
1
0.40 ± 0.10
(DC8) DFN 0106 REVØ
0.23 ± 0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
2934f