STM32F103ZFH6 STMicroelectronics, STM32F103ZFH6 Datasheet - Page 116

• Manufacturer Part Number: STM32F103ZFH6
• Description: 16/32-BITS MICROS
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZFH6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package characteristics
6.2.2
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Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in
information
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F103xF and STM32F103xG at maximum
dissipation, it is useful to calculate the exact power consumption and junction temperature to
determine which temperature range will be best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.
Example 1: High-performance application
Assuming the following application conditions:
Thus: P
Using the values obtained in
This is within the range of the suffix 6 version parts (–40 < T
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Table 70: STM32F103xF and STM32F103xG ordering information
Example 2: High-temperature application
Using the same rules, it is possible to address applications that run at high ambient
temperatures with a low dissipation, as long as junction temperature T
specified range.
Assuming the following application conditions:
Thus: P
Maximum ambient temperature T
I
level with I
at low level with I
P
P
This gives: P
P
–
T
Maximum ambient temperature T
I
level with I
P
P
This gives: P
P
DDmax
DDmax
Jmax
INTmax
IOmax
Dmax
INTmax
IOmax
Dmax
Dmax
Dmax
For LQFP100, 46 °C/W
= 82 °C + (46 °C/W × 447 mW) = 82 °C + 20.6 °C = 102.6 °C
= 175 + 272 = 447 mW
= 70 + 64 = 134 mW
scheme.
= 50 mA, V
= 20 mA, V
= 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
= 20 × 8 mA × 0.4 V = 64 mW
= 447 mW
= 134 mW
= 50 mA × 3.5 V= 175 mW
= 20 mA × 3.5 V= 70 mW
OL
OL
INTmax
INTmax
= 8 mA, V
= 8 mA, V
OL
DD
DD
= 175 mW and P
= 70 mW and P
= 20 mA, V
= 3.5 V, maximum 20 I/Os used at the same time in output at low
= 3.5 V, maximum 20 I/Os used at the same time in output at low
OL
OL
Table 69
Table 70: STM32F103xF and STM32F103xG ordering
= 0.4 V and maximum 8 I/Os used at the same time in output
Doc ID 16554 Rev 2
= 0.4 V
OL
Amax
Amax
T
= 1.3 V
Jmax
IOmax
IOmax
= 82 °C (measured according to JESD51-2),
= 115 °C (measured according to JESD51-2),
is calculated as follows:
= 64 mW:
= 272 mW:
STM32F103xF, STM32F103xG
J
< 105 °C).
scheme).
J
remains within the