STM32F103ZFH6 STMicroelectronics, STM32F103ZFH6 Datasheet
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
STM32F103ZFH6
Specifications of STM32F103ZFH6
Available stocks
Related parts for STM32F103ZFH6
STM32F103ZFH6 Summary of contents
Page 1
XL-density performance line ARM-based 32-bit MCU with 768 Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex™-M3 CPU with MPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) ...
Page 2
Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 3
STM32F103xF, STM32F103xG 2.3.29 2.3.30 2.3.31 3 Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 4
Contents 5.3.19 5.3.20 5.3.21 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 5
STM32F103xF, STM32F103xG List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 6
List of tables Table 45. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 7
STM32F103xF, STM32F103xG List of figures Figure 1. STM32F103xF and STM32F103xG performance line block diagram Figure 2. Clock tree . . . . . ...
Page 8
List of figures Figure 40. Standard I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 9
... This datasheet provides the ordering information and mechanical device characteristics of the STM32F103xF and STM32F103xG XL-density performance line microcontrollers. For more details on the whole STMicroelectronics STM32F103xx family, please refer to Section 2.2: Full compatibility throughout the The XL-density STM32F103xx datasheet should be read in conjunction with the STM32F10xxx reference manual ...
Page 10
Description 2 Description The STM32F103xF and STM32F103xG performance line family incorporates the high- performance ARM speed embedded memories (Flash memory Mbyte and SRAM Kbytes), and an extensive range of enhanced I/Os and peripherals connected ...
Page 11
STM32F103xF, STM32F103xG 2.1 Device overview The STM32F103xx XL-density performance line family offers devices in four different package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an ...
Page 12
Description Figure 1. STM32F103xF and STM32F103xG performance line block diagram TRACECLK TRACED[0:3] TPIU ETM as AF Trace/Trig SWJTAG NJTRST JTDI MPU JTCK/SWCLK JTMS/SWDAT JTDO Cortex-M3 CPU 48/72 MHz max NVIC NVIC GP DMA1 7 channels GP ...
Page 13
STM32F103xF, STM32F103xG Figure 2. Clock tree 8 MHz HSI RC OSC_OUT 4-16 MHz HSE OSC OSC_IN OSC32_IN LSE OSC 32.768 kHz OSC32_OUT LSI RC 40 kHz Main Clock Output MCO 1. When the HSI is used as a PLL clock ...
Page 14
Description 2.2 Full compatibility throughout the family The STM32F103xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low-density devices, the STM32F103x8 and STM32F103xB are ...
Page 15
STM32F103xF, STM32F103xG 2.3 Overview ® 2.3.1 ARM Cortex™-M3 core with embedded Flash and SRAM The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the ...
Page 16
Description 2.3.5 Embedded SRAM 96 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states. 2.3.6 FSMC (flexible static memory controller) The FSMC is embedded in the STM32F103xF and STM32F103xG performance line family. It has four ...
Page 17
STM32F103xF, STM32F103xG 2.3.10 Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-16 MHz clock can be selected, in which case it ...
Page 18
Description 2.3.14 Voltage regulator The regulator has three operation modes: main (MR), low power (LPR) and power down. ● used in the nominal regulation mode (Run) ● LPR is used in the Stop modes. ● Power down is ...
Page 19
STM32F103xF, STM32F103xG The DMA can be used with the main peripherals: SPI, I and advanced-control timers TIMx, DAC, I 2.3.17 RTC (real-time clock) and backup registers The RTC and the backup registers are supplied through a switch that takes power ...
Page 20
Description programmable inserted dead-times. They can also be seen as a complete general-purpose timer. The 4 independent channels can be used for: ● Input capture ● Output compare ● PWM generation (edge or center-aligned modes) ● One-pulse mode output If ...
Page 21
STM32F103xF, STM32F103xG Independent watchdog The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler clocked from an independent 40 kHz internal RC and as it operates independently from the main clock, it can operate in Stop ...
Page 22
Description 2.3.21 Serial peripheral interface (SPI three SPIs are able to communicate Mbits/s in slave and master modes in full-duplex and simplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the frame ...
Page 23
STM32F103xF, STM32F103xG The I/Os alternate function configuration can be locked if needed following a specific sequence in order to avoid spurious writing to the I/Os registers. 2.3.27 ADC (analog to digital converter) Three 12-bit analog-to-digital converters are embedded into STM32F103xF ...
Page 24
Description connected to the ADC1_IN16 input channel which is used to convert the sensor output voltage into a digital value. 2.3.30 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP Interface is embedded, and is a combined JTAG and serial ...
Page 25
STM32F103xF, STM32F103xG 3 Pinouts and pin descriptions Figure 3. STM32F103xF and STM32F103xG XL-density performance line BGA144 ballout PC13- PE3 PE2 A TAMPER-RTC PC14- B PE4 PE5 OSC32_IN PC15 BAT PF0 OSC32_OUT D OSC_IN V SS_5 ...
Page 26
Pinouts and pin descriptions Figure 4. STM32F103xF and STM32F103xG XL-density performance line LQFP144 pinout PE2 1 PE3 2 PE4 3 PE5 4 PE6 5 VBAT 6 PC13-TAMPER-RTC 7 PC14-OSC32_IN 8 PC15-OSC32_OUT 9 PF0 10 PF1 11 PF2 12 PF3 13 ...
Page 27
STM32F103xF, STM32F103xG Figure 5. STM32F103xF and STM32F103xG XL-density performance line LQFP100 pinout VBAT PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 OSC_IN OSC_OUT NRST VSSA VREF- VREF+ VDDA PA0-WKUP PE2 1 PE3 2 PE4 3 PE5 4 PE6 ...
Page 28
Pinouts and pin descriptions Figure 6. STM32F103xF and STM32F103xG XL-density performance line LQFP64 pinout PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT 28/120 VBAT PD0 ...
Page 29
STM32F103xF, STM32F103xG Table 5. STM32F103xF and STM32F103xG pin definitions Pins Pin name PE2 PE3 PE4 PE5 PE6 ...
Page 30
Pinouts and pin descriptions Table 5. STM32F103xF and STM32F103xG pin definitions (continued) Pins Pin name REF DDA PA0-WKUP PA1 ...
Page 31
STM32F103xF, STM32F103xG Table 5. STM32F103xF and STM32F103xG pin definitions (continued) Pins Pin name PF14 PF15 PG0 PG1 PE7 L7 - ...
Page 32
Pinouts and pin descriptions Table 5. STM32F103xF and STM32F103xG pin definitions (continued) Pins Pin name K10 - 60 82 PD13 SS_8 DD_8 K11 - 61 85 PD14 K12 - 62 ...
Page 33
STM32F103xF, STM32F103xG Table 5. STM32F103xF and STM32F103xG pin definitions (continued) Pins Pin name A10 50 77 110 PA15 B11 51 78 111 PC10 B10 52 79 112 PC11 C10 53 80 113 PC12 E10 5 81 114 PD0 D10 6 ...
Page 34
... This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: www.st.com. 8. For the LQFP64 package, the pins number 5 and 6 are configured as OSC_IN/OSC_OUT after reset, however the functionality of PD0 and PD1 can be remapped by software on these pins ...
Page 35
STM32F103xF, STM32F103xG Table 6. FSMC pin definition Pins CF PE2 PE3 PE4 PE5 PE6 PF0 A0 PF1 A1 PF2 A2 PF3 A3 PF4 A4 PF5 A5 PF6 NIORD PF7 NREG PF8 NIOWR PF9 CD PF10 INTR PF11 NIOS16 PF12 A6 ...
Page 36
Pinouts and pin descriptions Table 6. FSMC pin definition (continued) Pins CF PD9 D14 PD10 D15 PD11 PD12 PD13 PD14 D0 PD15 D1 PG2 PG3 PG4 PG5 PG6 PG7 PD0 D2 PD1 D3 PD3 PD4 NOE PD5 NWE PD6 NWAIT ...
Page 37
STM32F103xF, STM32F103xG 4 Memory mapping The memory map is shown in Figure 7. Memory map 0xFFFF FFFF 0xE000 0000 0xDFFF FFFF 0xC000 0000 0xBFFF FFFF 0xA000 0000 0x9FFF FFFF 0x8000 0000 0x7FFF FFFF 0x6000 0000 0x5FFF FFFF 0x4000 0000 0x3FFF ...
Page 38
Electrical characteristics 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...
Page 39
STM32F103xF, STM32F103xG 5.1.6 Power supply scheme Figure 10. Power supply scheme Caution: In Figure 10, the 4.7 µF capacitor must be connected to V 5.1.7 Current consumption measurement Figure 11. Current consumption measurement scheme DD3 BAT V ...
Page 40
Electrical characteristics 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 8: Current characteristics, and damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. ...
Page 41
STM32F103xF, STM32F103xG Table 9. Thermal characteristics Symbol T STG T J 5.3 Operating conditions 5.3.1 General operating conditions Table 10. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock ...
Page 42
Electrical characteristics 5.3.2 Operating conditions at power-up / power-down The parameters given in temperature condition summarized in Table 11. Operating conditions at power-up / power-down Symbol V rise time rate DD t VDD V fall time rate DD 5.3.3 Embedded ...
Page 43
STM32F103xF, STM32F103xG 5.3.4 Embedded reference voltage The parameters given in temperature and V Table 13. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when (1) T reading the internal reference S_vrefint voltage Internal reference voltage ...
Page 44
Electrical characteristics Table 14. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply current Run mode 1. Based on characterization, not tested in production. 2. External clock is 8 MHz ...
Page 45
STM32F103xF, STM32F103xG Figure 12. Typical current consumption in Run mode versus frequency (at 3 code with data processing running from RAM, peripherals enabled Figure 13. Typical current consumption in Run mode versus frequency (at 3.6 V)- code with ...
Page 46
Electrical characteristics Table 16. Maximum current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Based on characterization, tested in production External clock is 8 MHz ...
Page 47
STM32F103xF, STM32F103xG Table 17. Typical and maximum current consumptions in Stop and Standby modes Symbol Parameter Regulator in run mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog), Supply current MHz CK ...
Page 48
Electrical characteristics Figure 15. Typical current consumption in Stop mode with regulator in run mode versus temperature at different V 48/120 STM32F103xF, STM32F103xG values DD Doc ID 16554 Rev 2 ...
Page 49
STM32F103xF, STM32F103xG Figure 16. Typical current consumption in Stop mode with regulator in low-power mode versus temperature at different V Figure 17. Typical current consumption in Standby mode versus temperature at different V values DD Doc ID 16554 Rev 2 ...
Page 50
Electrical characteristics Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static value at V ● All peripherals are disabled except explicitly mentioned. ● The ...
Page 51
STM32F103xF, STM32F103xG Table 19. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply I current in DD Sleep mode 1. Typical values are measures Add an additional power consumption of 0.8 ...
Page 52
Electrical characteristics On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in under the following conditions: ● all I/O pins are in input mode with a static value at V ● all peripherals are disabled unless ...
Page 53
STM32F103xF, STM32F103xG Table 20. Peripheral current consumption Peripheral APB2 MHz, f HCLK 2. Specific conditions for DAC: EN1, EN2 bits in the DAC_CR register are set to 1 and the converted value set to 0x800. 3. ...
Page 54
Electrical characteristics Table 21. High-speed external user clock characteristics Symbol User external clock source f HSE_ext frequency V OSC_IN input pin high level voltage HSEH V OSC_IN input pin low level voltage HSEL t w(HSE) OSC_IN high or low time ...
Page 55
STM32F103xF, STM32F103xG Low-speed external user clock generated from an external source The characteristics given in external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 22. Low-speed external user clock characteristics Symbol User External clock ...
Page 56
Electrical characteristics Figure 19. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) EXTER NAL CLOCK SOURC E 56/120 t f(LSE) t W(LSE) T LSE f LSE_ext OSC32_IN Doc ID 16554 Rev 2 STM32F103xF, ...
Page 57
STM32F103xF, STM32F103xG High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained ...
Page 58
Electrical characteristics Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical ...
Page 59
STM32F103xF, STM32F103xG Figure 21. Typical application with a 32.768 kHz crystal Resonator with integrated capacitors 5.3.7 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 25. HSI oscillator ...
Page 60
Electrical characteristics Table 26. LSI oscillator characteristics Symbol (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI –40 to 105 °C unless otherwise specified Based ...
Page 61
STM32F103xF, STM32F103xG 5.3.8 PLL characteristics The parameters given in temperature and V Table 28. PLL characteristics Symbol PLL input clock f PLL_IN PLL input clock duty cycle f PLL multiplier output clock PLL_OUT t PLL lock time LOCK Jitter Cycle-to-cycle ...
Page 62
Electrical characteristics Table 30. Flash memory endurance and data retention Symbol Parameter N Endurance END t Data retention RET 1. Based on characterization not tested in production. 2. Cycling performed over the whole temperature range. 5.3.10 FSMC characteristics Asynchronous waveforms ...
Page 63
STM32F103xF, STM32F103xG Figure 22. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms 1. Mode 2/B, C and D only. In Mode 1, FSMC_NADV is not used. Table 31. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to ...
Page 64
Electrical characteristics Table 31. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings Symbol t FSMC_NEx low to FSMC_NADV low v(NADV_NE) t FSMC_NADV low time w(NADV pF Preliminary values. Figure 23. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms FSMC_NEx FSMC_NOE ...
Page 65
STM32F103xF, STM32F103xG Table 32. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings Symbol t FSMC_NEx low to FSMC_NADV low v(NADV_NE) t FSMC_NADV low time w(NADV pF Preliminary values. Figure 24. Asynchronous multiplexed PSRAM/NOR read waveforms FSMC_NE FSMC_NOE ...
Page 66
Electrical characteristics Table 33. Asynchronous multiplexed PSRAM/NOR read timings Symbol t FSMC_BL hold time after FSMC_NOE high h(BL_NOE) t FSMC_NEx low to FSMC_BL valid v(BL_NE) t Data to FSMC_NEx high setup time su(Data_NE) t Data to FSMC_NOE high setup time ...
Page 67
STM32F103xF, STM32F103xG Figure 25. Asynchronous multiplexed PSRAM/NOR write waveforms FSMC_NEx FSMC_NOE FSMC_NWE FSMC_A[25:16] FSMC_NBL[1:0] FSMC_ AD[15:0] FSMC_NADV Table 34. Asynchronous multiplexed PSRAM/NOR write timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NWE low v(NWE_NE) t FSMC_NWE low ...
Page 68
Electrical characteristics Synchronous waveforms and timings Figure 26 through Table 38 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: ● BurstAccessMode = FSMC_BurstAccessMode_Enable; ● MemoryType = FSMC_MemoryType_CRAM; ● WriteBurst = FSMC_WriteBurst_Enable; ...
Page 69
STM32F103xF, STM32F103xG Table 35. Synchronous multiplexed NOR/PSRAM read timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x = 0...2) d(CLKL-NExL) t FSMC_CLK high to FSMC_NEx high (x = 0...2) d(CLKH-NExH) t FSMC_CLK low to FSMC_NADV low ...
Page 70
Electrical characteristics Figure 27. Synchronous multiplexed PSRAM write timings t w(CLK) FSMC_CLK FSMC_NEx t d(CLKL-NADVL) FSMC_NADV FSMC_A[25:16] FSMC_NWE t d(CLKL-ADV) FSMC_AD[15:0] FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) FSMC_NBL 70/120 t w(CLK) Data latency = 1 t d(CLKL-NExL) t d(CLKL-NADVH) ...
Page 71
STM32F103xF, STM32F103xG Table 36. Synchronous multiplexed PSRAM write timings Symbol t w(CLK) t d(CLKL-NExL) t d(CLKH-NExH) t d(CLKL-NADVL) t d(CLKL-NADVH) t d(CLKL-AV) t d(CLKH-AIV) t d(CLKL-NWEL) t d(CLKH-NWEH) t d(CLKL-ADV) t d(CLKL-ADIV) t d(CLKL-Data) t su(NWAITV-CLKH) t h(CLKH-NWAITV) t d(CLKL-NBLH) ...
Page 72
Electrical characteristics Figure 28. Synchronous non-multiplexed NOR/PSRAM read timings t w(CLK) FSMC_CLK t d(CLKL-NExL) FSMC_NEx t d(CLKL-NADVL) FSMC_NADV FSMC_A[25:0] FSMC_NOE FSMC_D[15:0] FSMC_NWAIT (WAITCFG = 1b, WAITPOL + 0b) FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) Table 37. Synchronous non-multiplexed NOR/PSRAM ...
Page 73
STM32F103xF, STM32F103xG Figure 29. Synchronous non-multiplexed PSRAM write timings t w(CLK) FSMC_CLK t d(CLKL-NExL) FSMC_NEx t d(CLKL-NADVL) FSMC_NADV FSMC_A[25:0] FSMC_NWE FSMC_D[15:0] FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) FSMC_NBL Table 38. Synchronous non-multiplexed PSRAM write timings Symbol t w(CLK) t ...
Page 74
Electrical characteristics PC Card/CompactFlash controller waveforms and timings Figure 30 through corresponding timings. The results shown in this table are obtained with the following FSMC configuration: ● COM.FSMC_SetupTime = 0x04; ● COM.FSMC_WaitSetupTime = 0x07; ● COM.FSMC_HoldSetupTime = 0x04; ● COM.FSMC_HiZSetupTime ...
Page 75
STM32F103xF, STM32F103xG Figure 31. PC Card/CompactFlash controller waveforms for common memory write access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NREG FSMC_NIOWR FSMC_NIORD t d(NCE4_1-NWE) FSMC_NWE FSMC_NOE FSMC_D[15:0] High t v(NCE4_1-A) t d(NREG-NCE4_1) t d(NIORD-NCE4_1) t w(NWE) MEMxHIZ =1 t v(NWE-D) Doc ID 16554 ...
Page 76
Electrical characteristics Figure 32. PC Card/CompactFlash controller waveforms for attribute memory read access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NIOWR FSMC_NIORD FSMC_NREG FSMC_NWE t d(NCE4_1-NOE) FSMC_NOE (1) FSMC_D[15:0] 1. Only data bits 0...7 are read (bits 8...15 are disregarded). 76/120 t v(NCE4_1-A) High ...
Page 77
STM32F103xF, STM32F103xG Figure 33. PC Card/CompactFlash controller waveforms for attribute memory write access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NIOWR FSMC_NIORD FSMC_NREG t d(NCE4_1-NWE) FSMC_NWE FSMC_NOE FSMC_D[7:0](1) 1. Only data bits 0...7 are driven (bits 8...15 remains HiZ). Figure 34. PC Card/CompactFlash controller ...
Page 78
Electrical characteristics Figure 35. PC Card/CompactFlash controller waveforms for I/O space write access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NREG FSMC_NWE FSMC_NOE FSMC_NIORD t d(NCE4_1-NIOWR) FSMC_NIOWR FSMC_D[15:0] Table 39. Switching characteristics for PC Card/CF read and write cycles Symbol FSMC_NCEx low (x = ...
Page 79
STM32F103xF, STM32F103xG Table 39. Switching characteristics for PC Card/CF read and write cycles Symbol t FSMC_NIOWR low width w(NIOWR) t FSMC_NIOWR low to FSMC_D[15:0] valid v(NIOWR-D) t FSMC_NIOWR high to FSMC_D[15:0] invalid h(NIOWR-D) t FSMC_NCE4_1 low to FSMC_NIOWR valid d(NCE4_1-NIOWR) ...
Page 80
Electrical characteristics Figure 36. NAND controller waveforms for read access FSMC_NCEx ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NWE FSMC_NOE (NRE) FSMC_D[15:0] Figure 37. NAND controller waveforms for write access FSMC_NCEx ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NWE FSMC_NOE (NRE) FSMC_D[15:0] Figure 38. NAND controller ...
Page 81
STM32F103xF, STM32F103xG Figure 39. NAND controller waveforms for common memory write access FSMC_NCEx ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NWE FSMC_NOE FSMC_D[15:0] Table 40. Switching characteristics for NAND Flash read and write cycles Symbol (2) t FSMC_D[15:0] valid before FSMC_NWE high d(D-NWE) ...
Page 82
Electrical characteristics 5.3.11 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by ...
Page 83
STM32F103xF, STM32F103xG Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD ...
Page 84
Electrical characteristics Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: ● A supply overvoltage is applied to each power supply pin ● A current injection is applied to each input, output and ...
Page 85
STM32F103xF, STM32F103xG 5.3.14 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 46. I/O static characteristics Symbol Parameter Standard IO input low level voltage V IL (1) IO ...
Page 86
Electrical characteristics Figure 40. Standard I/O input characteristics - CMOS port Figure 41. Standard I/O input characteristics - TTL port 86/120 STM32F103xF, STM32F103xG Doc ID 16554 Rev 2 ...
Page 87
STM32F103xF, STM32F103xG Figure 42 tolerant I/O input characteristics - CMOS port Figure 43 tolerant I/O input characteristics - TTL port Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, ...
Page 88
Electrical characteristics Output voltage levels Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 10. All I/Os are CMOS and TTL compliant. Table 47. Output voltage characteristics Symbol Output low level voltage for an I/O ...
Page 89
STM32F103xF, STM32F103xG Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 48, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 10. Table 48. I/O AC characteristics MODEx[1:0] ...
Page 90
Electrical characteristics Figure 44. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved 2/3)T and if the duty cycle is (45-55%) 5.3.15 NRST pin characteristics The NRST pin input ...
Page 91
STM32F103xF, STM32F103xG 5.3.16 TIM timer characteristics The parameters given in Refer to Section 5.3.14: I/O port characteristics function characteristics (output compare, input capture, external clock, PWM output). Table 50. TIMx Symbol t Timer resolution time res(TIM) Timer external clock f ...
Page 92
Electrical characteristics 5.3.17 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table The STM32F103xC, STM32F103xD and STM32F103xESTM32F103xF and STM32F103xG performance line I protocol with the following restrictions: ...
Page 93
STM32F103xF, STM32F103xG 2 Figure 46 bus AC waveforms and measurement circuit bus S TART SDA t r(SDA) t f(SDA) t h(STA) SCL t w(SCLH) 1. Measurement points are done at CMOS levels: 0.3V Table 52. ...
Page 94
Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in are derived from tests performed under ambient temperature, f supply voltage conditions summarized in Refer to Section 5.3.14: I/O port characteristics function characteristics (NSS, SCK, ...
Page 95
STM32F103xF, STM32F103xG Figure 47. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...
Page 96
Electrical characteristics Figure 49. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V 96/120 ...
Page 97
STM32F103xF, STM32F103xG 2 Table 54 characteristics Symbol Parameter I2S slave input clock duty DuCy(SCK) cycle clock frequency 1/t c(CK r(CK clock rise and fall time t f(CK) (1) t ...
Page 98
Electrical characteristics 2 Figure 50 slave timing diagram (Philips protocol) CPOL = 0 CPOL = 1 WS input SD transmit SD receive 1. Measurement points are done at CMOS levels: 0.3 × LSB transmit/receive of the ...
Page 99
STM32F103xF, STM32F103xG SD/SDIO MMC card host interface (SDIO) characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table Refer to Section 5.3.14: I/O port characteristics function characteristics (D[7:0], CMD, CK). Figure 52. SDIO high-speed ...
Page 100
Electrical characteristics Table 55 MMC characteristics Symbol Clock frequency in data transfer f PP mode t Clock low time, f W(CKL) t Clock high time, f W(CKH) t Clock rise time r t Clock fall time f CMD, ...
Page 101
STM32F103xF, STM32F103xG Table 57. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (4) V Differential input sensitivity DI (4) V Differential common mode range Includes V CM (4) V Single ended receiver threshold SE Output levels ...
Page 102
Electrical characteristics 5.3.19 12-bit ADC characteristics Unless otherwise specified, the parameters given in from tests performed under ambient temperature, f conditions summarized in Note recommended to perform a calibration after each power-up. Table 59. ADC characteristics Symbol Parameter ...
Page 103
STM32F103xF, STM32F103xG Equation 1: R AIN R ------------------------------------------------------------- - R AIN ADC The formula above allowed for an error below 1/4 of LSB. Here (from 12-bit resolution). Table 60. R AIN T (cycles) ...
Page 104
Electrical characteristics Table 62. ADC accuracy Symbol ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error 1. ADC DC accuracy values are measured after internal calibration. 2. Better performance could be ...
Page 105
STM32F103xF, STM32F103xG Figure 56. Typical connection diagram using the ADC R AIN (1) V AIN 1. Refer to Table represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the parasitic pad capacitance ...
Page 106
Electrical characteristics Figure 58. Power supply and reference decoupling ( and V REF+ REF– 106/120 1 µ inputs are available only on 100-pin packages. Doc ID 16554 Rev 2 STM32F103xF, STM32F103xG V ) connected to ...
Page 107
STM32F103xF, STM32F103xG 5.3.20 DAC electrical specifications Table 63. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Ground SSA Resistive load vs. V SSA buffer ON (1) R LOAD Resistive load vs. V DDA ...
Page 108
Electrical characteristics Table 63. DAC characteristics (continued) Symbol Parameter Integral non linearity (difference between measured value at Code i (2) INL and the value at Code line drawn between Code 0 and last Code 1023) Offset error ...
Page 109
STM32F103xF, STM32F103xG 5.3.21 Temperature sensor characteristics Table 64. TS characteristics Symbol ( SENSE (1) Avg_Slope Average slope (1) V Voltage at 25 °C 25 (2) t Startup time START ADC sampling time when reading the (3)(2) T ...
Page 110
Package characteristics 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...
Page 111
STM32F103xF, STM32F103xG Figure 61. LFBGA144 – 144-ball low profile fine pitch ball grid array mm, 0.8 mm pitch, package outline 1. Drawing is not to scale. Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid ...
Page 112
Package characteristics Figure 62. LQFP144 mm, 144-pin low-profile quad flat package outline Seating plane ccc 108 109 144 Pin 1 1 identification 1. Drawing is not to scale. ...
Page 113
STM32F103xF, STM32F103xG Figure 64. LQFP100 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. 2. Dimensions are in ...
Page 114
Package characteristics Figure 66. LQFP64 – pin low-profile quad flat package outline Pin 1 identification Drawing is not to scale. 2. Dimensions ...
Page 115
STM32F103xF, STM32F103xG 6.2 Thermal characteristics The maximum chip junction temperature (T Table 10: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: ● T max is the maximum ambient temperature in °C, A ...
Page 116
Package characteristics 6.2.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in information scheme. Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation ...
Page 117
STM32F103xF, STM32F103xG Using the values obtained in – For LQFP100, 46 °C 115 °C + (46 °C/W × 134 mW) = 115 °C + 6.2 °C = 121.2 °C Jmax This is within the range of the suffix ...
Page 118
Part numbering 7 Part numbering Table 70. STM32F103xF and STM32F103xG ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 103 = performance line Pin count pins V = ...
Page 119
STM32F103xF, STM32F103xG 8 Revision history Table 71. Document revision history Date Revision 27-Oct-2009 15-Nov-2010 1 Initial release. LQFP64 package mechanical data updated: see pin low-profile quad flat package outline LQFP64 – ...
Page 120
... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...