1323XDSK-BDM Freescale Semiconductor, 1323XDSK-BDM Datasheet - Page 26

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1323XDSK-BDM

Manufacturer Part Number
1323XDSK-BDM
Description
1323X DEVELOPER KIT BDM
Manufacturer
Freescale Semiconductor
Series
-r
Type
Transceiver, Microcontrollerr
Datasheets

Specifications of 1323XDSK-BDM

Frequency
2.4GHz
Kit Application Type
Wireless Connectivity
Application Sub Type
RF Transceiver
Rohs Compliant
Yes
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MC1323x
11.7
The reference oscillator model including external crystal in shown in
Standard requires a frequency tolerance less than or equal to +/- 40 ppm as shown in the oscillator
specification
typically trimmed to be held to +/- 30 ppm over all conditions.
26
1
Frequency (nominal)
Oscillator frequency tolerance over temperature range.
External load capacitance
Internal Osc startup time
This is part of device wake-up time.
Frequency
Frequency tolerance (cut tolerance)
Fine Tune [3:0]
Crystal Reference Clock Oscillator Characteristics
Table
Coarse Tune [3:0]
with steps of 20 fF.
with steps of 281 fF.
11. With a suitable crystal (refer to
Parameter
0-300 fF
1
0-4.215 pF
Characteristic
Table 12. Recommended 32 MHz Crystal Specifications
Table 11. Reference Oscillator Specifications
EXTAL_32M
Figure 4. 32MHz Reference Oscillator Model
C L1
MC1323x Advance Information, Rev. 1.2
REFERENCE
OSCILLATOR
32 MHz
C stray
32.000000
Value
± 10
C RY STAL
Y 1
Table
MHz
Unit
ppm
12), the device frequency tolerance can
Symbol
C
t
Lext
cst
max at 25 °C
Cs tray
XTAL_32M
with steps of 281 fF.
with steps of 20 fF.
Figure
Min
MC1323x
Coarse Tune [3:0]
0-4.215 pF
0-300 fF
CL2
Condition
4. The IEEE 802.15.4
32.000000
Fine Tune [3:0]
+/- 30
Typ
800
8
Freescale Semiconductor
+/- 40
Max
MHz
Unit
ppm
pF
μs

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