AS1154-BSOT austriamicrosystems, AS1154-BSOT Datasheet - Page 3

• Manufacturer Part Number: AS1154-BSOT
• Description: IC LVDS DRIVER DUAL 8-SOIC
• Manufacturer: austriamicrosystems
• Type: Driverr

Specifications of AS1154-BSOT

• Number Of Drivers/receivers: 2/0
• Protocol: LVDS
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AS1154
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
1. Depending on actual PCB layout and PCB used.
2. P
www.austriamicrosystems.com/Interfaces-LVDS/AS1154
Electrical Parameters
Electrostatic Discharge
Continous Power Dissipation (T
Temperature Ranges and Storage Conditions
T
Continous Power Dissipation Derating Factor
A
DERATE
=85ºC calculate P
Short Circuit Duration (OUTx+, OUTx-)
Electrostatic Discharge HBM
Continous Power Dissipation
Storage Temperature Range
Package Body Temperature
derating factor changes the total continuous power dissipation (P
Humidity non-condensing
Moisture Sensitive Level
OUTx+, OUTx- to GND
Junction Temperature
VCC to GND
INx to GND
Parameter
T
at 85ºC = P
A
T
= +70°C)
- P
DERATE
x (85ºC - 70ºC)
Min
-0.3
-0.3
-0.3
-55
5
Continuous
+/- 4
1
Vcc + 0.3
+150
+125
+260
Revision 1.02
Max
755
5.0
5.0
9.4
85
T
mW / °C
) if the ambient temperature is not 70ºC. Therefore for e.g.
Units
mW
kV
ºC
ºC
ºC
%
V
V
V
The lead finish for Pb-free leaded packages is matte tin
Norm: MIL 883 E method 3015, INx, OUTx+, OUTx-
Classification for Non-Hermetic Solid State Surface
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
The reflow peak soldering temperature (body
Represents a max. floor life time of unlimited
P
T 1
for 8-pin SOIC Package
Mount Devices”.
Comments
P
(100% Sn).
DERATE 2
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