20102 OK International, 20102 Datasheet - Page 20

• Manufacturer Part Number: 20102
• Description: Soldering Tools Micrometer Head
• Manufacturer: OK International

Specifications of 20102

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

18
Manual Lift-off
If your PCB is densely populated and adjacent component heating is a considerable issue, it is possible for
the nozzle to be closer to the components lead array than with the above procedure. This can be accom-
plished by lowering the head so that the nozzle is encapsulating the component, and then adjusting the
spring loaded Z-Axis adjuster on the BGA Head Assembly so that the vacuum pad is in contact with the
component (with the vacuum pump activated the vacuum LED will illuminate to confirm vacuum seal).
Component lift off is accomplished via the Z-Axis control lever on the reflow arm at the end of the reflow
cycle. The operator is now responsible for lifting the component at the end of the heating cycle prior to the
cooling zone.
Please note that a placement profile should be used for this process (even though a component is being
removed) to ensure that the vacuum tube does not automatically lift.
VI. ADDITIONAL SYSTEM FEATURES
A. TYPE-K THERMOCOUPLE INPUT
The BGA/CSP-3500 Series are equipped with a Type-K thermocouple input to measure an external temper-
ature at any time.
To use this feature:
1. Plug the male connector from the external thermocouple into female connector on the BGA-1
2. Slide the “time/thermocouple” switch on the BGA-1 module to the “thermocouple” position.
3. At this point the bottom display will read the temperature of the external thermocouple in the scale
NOTE: The BGA-1 module will display the temperature of the external thermocouple whenever the
“time/thermocouple” switch is in the “thermocouple” position. If this switch is in the “thermocouple” posi-
tion and no thermocouple is connected, the bottom display will read, “Err”.
B. BGA-NA SMT NOZZLE ADAPTER
With the optional BGA-NA nozzle adapter, your BGA/CSP-3500 Series Rework System can be used to
rework SMT components. This nozzle adapter will enable you to use the broad range of FCR/MTR Series
nozzles available from Metcal. Custom nozzles are also available upon request.
VII. TROUBLESHOOTING
This section provides basic suggestions to assist with problems that might be encountered with your
BGA/CSP-3500. If you are in need of any additional assistance, contact your local Metcal Representative,
or email us at [e-mail].
Placement Assembly
1. Problem: No image appears on the monitor.
Check:
• Is the prism assembly fully retracted?
• Is the monitor set to the correct input source?
• Is the cable connected to the correct input
receptacle on the monitor?
module (15).
(°F or °C) that you have previously selected.
Possible Solution:
• Slide prism bar fully out.
• Select the input that corresponds with the input
• Ensure that the video cable is conncected to the
source that you have selected.
correct input receptacle on the monitor.
BGA-3500 Series Manual 5/01