20102 OK International, 20102 Datasheet - Page 19

• Manufacturer Part Number: 20102
• Description: Soldering Tools Micrometer Head
• Manufacturer: OK International

Specifications of 20102

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

BGA-3500 Series Manual 5/01
• Select the flux transfer plate that meets the component’s requirements for size and depth.
• Using the squeegee, fill the cavity with paste flux. Use the squeegee to smooth the gel flux level with the
• Place the component into the adjustable component fixture and pick it up with the vacuum pipette,
• Using the micrometers, align the component in the X, Y and Theta axes.
• Remove the adjustable component fixture and replace it with the flux transfer plate.
• Slide the prism into the placement arm, unlocking the Z-axis arm and allowing you to rotate the knob
• Rotate the Z-axis knob counter clockwise until the solder balls contact the bottom plate of the flux
• Slide the flux transfer plate back towards the operator and remove it from the machine. Inspect the
• Pull out the prism and check component alignment, adjust as required.
• Push in the prism, rotate the Z-axis knob counter clockwise to place the component onto the PCB.
• Depress the footswitch to release the vacuum.
Application Note On Using The Optional BGA-NA For SMT Rework
The optional BGA-NA Nozzle Adapter allows the BGA/CSP-3500 to use Metcal’s range of FCR/MTR Nozzles
for SMT applications, as well as custom designed SMT nozzles to accommodate virtually any component.
When using the nozzle adapter, the exhaust of the SMT nozzle is extended about 1” from the RTD measur-
ing device as compared to BGA Micro Oven Nozzles. Because of this 1” extension, exhaust temperature will
decrease about 100°C from the source to the lead array.
To compensate for this loss in temperature, it is necessary to increase the profile topside temperature by
100°C. When running a profile, it is strongly recommend that the external thermocouple is secured with the
Kapton tape, and positioned so the thermocouple is in contact with the solder joint. This is necessary to
monitor the relative temperature of the solder joint and modify your profile parameters “on the fly” if nec-
essary, enabling the end user to yield the optimum reflow profile.
For SMT component removal with the BGA-NA nozzle adapter, there are two procedures you can select:
Automatic Vacuum Lift-off:
If automatic vacuum lift off is desired, it is necessary to raise the reflow head so the nozzle is raised off of
the lead array by approximately 1/2”. This space is necessary to compensate for the height difference of
the vacuum tube when the lift solenoid is in the downward position, and will ensure that the component
leads do not bump the rework nozzle when automatically lifted.
After the head is backed off 1/2”, depress the vacuum solenoid on the top of the BGA head assembly until
it “locks” in the down position. Activate the vacuum pump, unlock the spring-loaded Z-axis adjuster on the
BGA head assembly and lower the vacuum cup so it is in contact with the component to be removed. The
vacuum LED will illuminate on the reflow arm to confirm vacuum seal to the component. Start the lift pro-
file and observe the component automatically lift after the reflow cycle has terminated.
sides of the transfer plate. This ensures a repeatable deposit.
by depressing the footswitch to turn on the vacuum. Adjust the component height using the height
adjustment block.
to dip the component into the flux. Slide the flux transfer plate towards the placement arm to the
component pick-up position.
transfer plate. Rotate the Z-axis knob clockwise to raise the component out of the flux to the align-
ment position.
impression left in the flux to ensure all the solder balls have been coated. Failure to remove the flux
transfer plate between operations will result in the flux overheating; affecting the viscosity of the flux.
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