STM32L152-SK/IAR STMicroelectronics, STM32L152-SK/IAR Datasheet - Page 103

• Manufacturer Part Number: STM32L152-SK/IAR
• Description: MCU, MPU & DSP Development Tools STM32L152VBT6 IAR 32KB Workbench
• Manufacturer: STMicroelectronics
• Series: IAR Kickstartr
• Type: MCUr

Specifications of STM32L152-SK/IAR

• Contents: Board, CD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: STM32L

STM32L151xx, STM32L152xx
7.2
7.2.1
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 63.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O

JA
max represents the maximum power dissipation on output pins where:
T

P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
BGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
max is the product of I
Thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 17659 Rev 4
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max × 
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
59
46
45
55
16
I/O
max),
103/107
°C/W
Unit