MAX5056BASA Maxim Integrated Products, MAX5056BASA Datasheet - Page 2

• Manufacturer Part Number: MAX5056BASA
• Description: MOSFET & Power Driver ICs 4A 20ns Dual MOSFET Drivers
• Manufacturer: Maxim Integrated Products
• Type: Low Sider

Specifications of MAX5056BASA

• Rise Time: 85 ns
• Fall Time: 75 ns
• Supply Voltage (min): 4 V
• Supply Current: 2.4 mA
• Maximum Power Dissipation: 471 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 35 ns
• Maximum Turn-on Delay Time: 35 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Number Of Outputs: 2

ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
V
INA+, INA-, INB+, INB- ...............................................-0.3V to +18V
OUTA, OUTB...................................................-0.3V to (V
OUTA, OUTB Short-Circuit Duration ........................................10ms
Continuous Source/Sink Current at OUT_ (P
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
8 TDFN-EP
8 SO
4A, 20ns, Dual MOSFET Drivers
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
2
POWER SUPPLY
V
V
V
Hysteresis
V
Output Delay
V
DRIVER OUTPUT (SINK)
Driver Output Resistance Pulling
Down
Peak Output Current (Sinking)
Output-Voltage Low
Latchup Protection
DD
Junction-to-Ambient Thermal Resistance (
Junction-to-Case Thermal Resistance (
Junction-to-Ambient Thermal Resistance (
Junction-to-Case Thermal Resistance (
8-Pin TDFN-EP (derate 18.2mW/°C above +70°C)........1454mW
DD
DD
DD
DD
DD
DD
...............................................................................-0.3V to +18V
_______________________________________________________________________________________
= 4V to 15V, T
Operating Range
Undervoltage Lockout
Undervoltage Lockout
Undervoltage Lockout to
Supply Current
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40°C to +125°C, unless otherwise noted. Typical values are at V
A
= +70°C)
SYMBOL
JC
JC
I
R
UVLO
DD-SW
I
).......................+40°C/W
V
I
D
PK-N
ON-N
JA
I
LUP
)......................+8°C/W
DD
JA
DD
< P
)................+132°C/W
)...............+41°C/W
DMAX
V
V
INA- = INB- = V
INA+ = INB+ = 0V
(not switching)
INA- = 0V, INB+ = V
INA+ = INB- both channels switching at
250kHz, C
V
I
V
I
V
I
Reverse current I
OUT_
OUT_
OUT_
DD
DD
DD
DD
DD
) .....200mA
DD
rising
rising
= 15V,
= 4.5V,
= 15V, C
+ 0.3V)
= -100mA
= -100mA
= -100mA
L
= 0F
L
CONDITIONS
= 10,000pF
DD
OUT_
,
Operating Temperature Range..............................-40°C to +125°C
Storage Temperature Range .................................-65°C to +150°C
Junction Temperature ...........................................................+150°C
Lead Temperature (soldering, 10s)......................................+300°C
Soldering Temperature (reflow)............................................+260°C
8 SO-EP
DD
Junction-to-Ambient Thermal Resistance (
Junction-to-Case Thermal Resistance (
8-Pin SO-EP (derate 19.2mW/°C above +70°C)… ........1538mW
8-Pin SO (derate 5.9mW/°C above +70°C)… ..................471mW
(Note 2)
= 15V,
V
V
T
T
T
T
V
V
A
A
A
A
DD
DD
DD
DD
= +25°C
= +125°C
= +25°C
= +125°C
= 4V
= 15V
= 4.5V
= 15V
DD
= 15V and T
MIN
3.00
400
4
1
A
= +25 C.) (Note 2)
TYP
3.50
200
2.4
1.1
1.5
2.2
3.0
12
28
40
4
JC
JA
)......................+7°C/W
)..................+41°C/W
MAX
3.85
0.45
0.24
1.8
2.4
3.3
4.5
15
55
75
4
UNITS
mV
mA
mA
µA
µs
V
V
A
V