MAX5056BASA Maxim Integrated Products, MAX5056BASA Datasheet - Page 12

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MAX5056BASA

Manufacturer Part Number
MAX5056BASA
Description
MOSFET & Power Driver ICs 4A 20ns Dual MOSFET Drivers
Manufacturer
Maxim Integrated Products
Type
Low Sider
Datasheet

Specifications of MAX5056BASA

Rise Time
85 ns
Fall Time
75 ns
Supply Voltage (min)
4 V
Supply Current
2.4 mA
Maximum Power Dissipation
471 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Maximum Turn-off Delay Time
35 ns
Maximum Turn-on Delay Time
35 ns
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Number Of Outputs
2

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Both the SO-EP and TDFN-EP packages have an
exposed pad on the bottom of their package. These
pads are internally connected to GND. For the best
thermal conductivity, solder the exposed pad to the
4A, 20ns, Dual MOSFET Drivers
Figure 5. Push-Pull Converter with Synchronous Rectification Drive Using MAX5054
12
PWM IN
PWM IN
______________________________________________________________________________________
INA+
INA-
INB+
INB-
MAX5054
V
IN
OUTA
OUTB
GND
V
DD
V
DD
Exposed Pad
PWM IN
ground plane to dissipate 1.5W and 1.9W in SO-EP and
TDFN-EP packages, respectively. Do not use the
ground-connected pads as the only electrical ground
connection or ground return. Use GND (pin 3) as the
primary electrical ground connection.
Additional Application Circuits
INA+
INA-
INB+
INB-
MAX5054
OUTA
OUTB
GND
V
DD
V
OUT

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