TDA7073ATD-T NXP Semiconductors, TDA7073ATD-T Datasheet - Page 12

• Manufacturer Part Number: TDA7073ATD-T
• Description: MOSFET & Power Driver ICs 2XBTL POWER DRIVER
• Manufacturer: NXP Semiconductors

Specifications of TDA7073ATD-T

• Supply Voltage (min): 3 V
• Supply Current: 16 mA
• Maximum Power Dissipation: 1320 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-162
• Number Of Drivers: 2
• Number Of Outputs: 4
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: TDA7073AT/N4,118

NXP Semiconductors
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
1999 Aug 30
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
Dual BTL power driver
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
(4)
, SO, SOJ
PACKAGE
12
suitable
not suitable
not suitable
suitable
not recommended
not recommended
(2)
WAVE
TDA7073A; TDA7073AT
(3)
SOLDERING METHOD
(4)(5)
(6)
−
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
(1)
DIPPING
suitable
−
−
−
−
−