PIC16F887-I/PT Microchip Technology Inc., PIC16F887-I/PT Datasheet - Page 271

• Manufacturer Part Number: PIC16F887-I/PT
• Description: MCU, 8-Bit, 8KW Flash, 368 RAM, 36 I/O, TQFP-44
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F887-I/PT

• A/d Inputs: 14-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 256 Bytes
• Frequency: 20 MHz
• Input Output: 35
• Interface: I2C/SPI/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 44-pin TFQP
• Programmable Memory: 14K Bytes
• Ram Size: 368 Bytes
• Resistance, Drain To Source On: Bytes
• Serial Interface: MSSP or EUSART
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P or PL) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
PIC16F882/883/884/886/887
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
A2
1.980
MIN
.125
.015
.590
.485
.115
.008
.030
.014
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.625
.070
.023
.250
.195
.580
.200
.015
.700
–
DS41291D-page 269
c