MCP23S08-E/SO Microchip Technology Inc., MCP23S08-E/SO Datasheet - Page 34
MCP23S08-E/SO
Manufacturer Part Number
MCP23S08-E/SO
Description
8-BIT INPUT/OUTPUT EXPANDER, SPI INTERFACE
Manufacturer
Microchip Technology Inc.
Type
Programmable Peripheral Interfacer
Datasheet
1.MCP23S08-ESO.pdf
(44 pages)
Specifications of MCP23S08-E/SO
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23S08-E/SO
Manufacturer:
HIMAX
Quantity:
1 450
Part Number:
MCP23S08-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP23008/MCP23S08
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21919D-page 34
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
b1
E1
N
A
E
D
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.310
.250
.365
.130
.010
.060
.018
.130
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–