DSPIC30F3010-30I/SO Microchip Technology Inc., DSPIC30F3010-30I/SO Datasheet - Page 232

• Manufacturer Part Number: DSPIC30F3010-30I/SO
• Description: 16 BIT MCU/DSP 28LD 30MIPS 24 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3010-30I/SO

• A/d Inputs: 6-Channels, 10-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 20
• Interface: I2C/SPI/UART, USART
• Ios: 20
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 28-pin SOIC
• Programmable Memory: 24K Bytes
• Ram Size: 1K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

dsPIC30F
64-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70082G-page 230
B
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-066
β
*Controlling Parameter
Notes:
p
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Dimension Limits
#leads=n1
E1
E
Units
A2
D1
n1
(F)
E1
A1
α
D
B
β
n
p
A
c
L
φ
E
n
MIN
.004
.037
.002
.018
.012
Preliminary
11
11
2
1
φ
0
INCHES
D1
L
.039 REF
.630 BSC
.630 BSC
.551 BSC
.551 BSC
NOM
.031
64
16
D
.024
.015
.039
3.5
12
12
A
A1
MAX
.047
.006
.030
.008
.018
.041
13
13
(F)
7
MIN
0.95
0.05
0.45
0.30
0.09
11
11
0
MILLIMETERS*
 2004 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
NOM
0.80
16
64
1.00
0.60
0.37
3.5
12
12
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7
α