MCP23017-E/SP Microchip Technology Inc., MCP23017-E/SP Datasheet - Page 38
![no-image](/images/manufacturer_photos/0/4/440/microchip_technology_inc__sml.jpg)
MCP23017-E/SP
Manufacturer Part Number
MCP23017-E/SP
Description
I/O Port Expander, 16-Bit, I2C I'face, SDIP-28
Manufacturer
Microchip Technology Inc.
Type
Programmable Peripheral Interfacer
Datasheet
1.MCP23017-ESP.pdf
(48 pages)
Specifications of MCP23017-E/SP
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23017-E/SP
Manufacturer:
MICROCHIP
Quantity:
1 001
MCP23017/MCP23S17
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21952B-page 38
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.285
.130
.010
.050
.018
.135
28
–
–
–
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c