PIC16F887-E/P Microchip Technology Inc., PIC16F887-E/P Datasheet - Page 255
PIC16F887-E/P
Manufacturer Part Number
PIC16F887-E/P
Description
40 PIN, 14KB FLASH, 368 RAM, 36 I/O, PDIP
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC16F887-EP.pdf
(328 pages)
Specifications of PIC16F887-E/P
A/d Inputs
14-Channel, 10-Bit
Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Frequency
20 MHz
Input Output
35
Interface
I2C/SPI/USART
Memory Type
Flash
Number Of Bits
8
Package Type
40-pin PDIP
Programmable Memory
14K Bytes
Ram Size
368 Bytes
Resistance, Drain To Source On
Bytes
Serial Interface
MSSP or EUSART
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F887-E/P
Manufacturer:
TI
Quantity:
12 000
Company:
Part Number:
PIC16F887-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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17.6
© 2008 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F882/883/884/886/887
Typ.
47.2
24.4
45.8
60.2
80.2
89.4
24.7
20.0
14.5
23.8
23.9
20.0
150
29
29
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41291E-page 253
OH
* (V
DD
- V
OH
))
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