ISL83070EIBZA Intersil, ISL83070EIBZA Datasheet - Page 5

IC TXRX RS485/422 3.3V ESD14SOIC

ISL83070EIBZA

Manufacturer Part Number
ISL83070EIBZA
Description
IC TXRX RS485/422 3.3V ESD14SOIC
Manufacturer
Intersil
Type
Transceiverr
Datasheet

Specifications of ISL83070EIBZA

Number Of Drivers/receivers
1/1
Protocol
RS422, RS485
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Data Rate
800Kbps
Interface Circuit Standard 1
RS-422/RS-485
Number Of Receivers
1
Number Of Transmitters
1
Number Of Transceivers
1
Data Transmission Topology
Multidrop/Multipoint
Receiver Signal Type
Differential
Transmitter Signal Type
Differential
Single Supply Voltage (typ)
3.3V
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
3.6V
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Supply Requirement
Single
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISL83070EIBZA
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
ISL83070EIBZA-T
Manufacturer:
LT
Quantity:
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Part Number:
ISL83070EIBZA-T
Manufacturer:
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Quantity:
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Part Number:
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0
Electrical Specifications
Absolute Maximum Ratings
V
Input Voltages
Input/Output Voltages
Short Circuit Duration
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
DC CHARACTERISTICS
Driver Differential V
Change in Magnitude of Driver
Differential V
Complementary Output States
Driver Common-Mode V
Change in Magnitude of Driver
Common-Mode V
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Hysteresis
Logic Input Current
Input Current (A, B, A/Y, B/Z)
Output Leakage Current (Y, Z) (Full
Duplex Versions Only, Note 12)
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
Note 12)
Driver Short-Circuit Current,
V
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
Receiver Output High Voltage
3. θ
CC
O
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
= High or Low
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETER
OUT
OUT
for
OUT
for
OUT
5
Test Conditions: V
Typicals are at V
SYMBOL
I
ΔV
ΔV
V
ΔV
OSD1
V
V
V
V
I
I
I
I
V
V
HYS
IN1
IN2
IN3
IN4
OD
OC
OH
TH
IH
OD
OC
IL
TH
R
R
No Load
R
R
R
R
DI, DE, RE
DI, DE, RE
DE, RE, (Note 14)
DI = DE = RE = 0V or V
DE = 0V, V
3.6V
RE = 0V, DE = 0V,
V
RE = V
V
DE = V
-7V ≤ V
V
I
O
CC
CC
CM
CC
L
L
L
L
L
L
= -4mA, V
CC
= 100Ω (RS-422) (Figure 1A, Note 15)
= 54Ω (RS-485) (Figure 1A)
= 60Ω, -7V ≤ V
= 54Ω or 100Ω (Figure 1A)
= 54Ω or 100Ω (Figure 1A)
= 54Ω or 100Ω (Figure 1A)
= 0V or 3.6V
= 0V or 3.6V
= 3.3V, T
= 0V
= 3.0V to 3.6V; Unless Otherwise Specified.
CC
CC
CC
CM
, DE = 0V,
, -7V ≤ V
+0.3V)
CC
≤ 12V
ID
TEST CONDITIONS
A
= 0V or
= -50mV
= +25°C (Note 4).
CM
Y
or V
≤ 12V (Figure 1B)
CC
Z
, (Note 17)
V
V
V
V
V
V
≤ 12V (Note 6)
Thermal Information
Thermal Resistance (Typical, Note 3)
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
IN
IN
IN
IN
IN
IN
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
= 12V
= -7V
= 12V
= -7V
= 12V
= -7V
TEMP
(°C)
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
25
25
V
(Note 18)
CC
-100
-200
MIN
1.5
1.5
-40
-40
-2
2
2
-
-
-
-
-
-
-
-
-
-
-
- 0.6
TYP
0.01
0.01
-125
100
2.3
2.2
-50
-10
-10
80
10
10
15
2
2
-
-
-
-
-
-
(Note 18) UNITS
MAX
±250
V
V
125
0.2
0.2
0.8
-50
40
40
CC
CC
3
2
-
-
-
-
-
-
-
-
-
θ
June 22, 2007
JA
105
140
128
FN6115.4
(°C/W)
mV
mA
mV
mV
μA
μA
μA
μA
μA
μA
μA
V
V
V
V
V
V
V
V
V

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