TDA8034AT/C1,118 NXP Semiconductors, TDA8034AT/C1,118 Datasheet - Page 18

• Manufacturer Part Number: TDA8034AT/C1,118
• Description: IC SMART CARD INTERFACE 16SOIC
• Manufacturer: NXP Semiconductors
• Type: Smart Card Interfacer

Specifications of TDA8034AT/C1,118

• Package / Case: 16-SOIC (3.9mm Width)
• Controller Type: Smart Card Interface
• Interface: Analog
• Voltage - Supply: 3V, 5V
• Current - Supply: 65mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935289276118

NXP Semiconductors
Table 7.
V
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Table 8.
TDA8034T_TDA8034AT
Product data sheet
Symbol
f
t
Card detection input
V
V
V
I
I
OFFN output
V
V
R
Symbol
I
I
T
CMDVCCN
w
IL
IH
Olim
sd
DDP
sd
IL
IH
hys
OL
OH
pu
To meet these specifications, V
either 100 nF or one 220 nF and one 470 nF.
Using decoupling capacitors of one 220 nF ± 20 % and one 470 nF ± 20 %.
Using the integrated 9 kΩ pull-up resistor connected to V
Using the integrated 10 kΩ pull-up resistor connected to V
The transition time and the duty factor definitions are shown in
Pins PRESN and CMDVCCN are active LOW; pin RSTIN is active HIGH; see
Pin PRESN has an integrated current source of 1.25 μA to V
Pin OFFN is an NMOS drain, using an internal 20 kΩ pull-up resistor connected to V
= 5 V; V
Parameter
frequency on pin
CMDVCCN
pulse width
LOW-level input
voltage
HIGH-level input
voltage
hysteresis voltage
LOW-level input current 0 V < V
HIGH-level input
current
LOW-level output
voltage
HIGH-level output
voltage
pull-up resistance
Characteristics of IC supply voltage
Protection characteristics
Parameter
output current limit
shutdown current
shutdown temperature
DD
[8]
= 3.3 V; V
[6][7]
DD(INTF)
CC
= 3.3 V; f
should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of
Conditions
5 V card;
3 V card;
Figure 12
pin PRESN
0 V < V
I
I
connected to V
OL
OH
= 2 mA
= −15 μA
All information provided in this document is subject to legal disclaimers.
xtal
IL
IH
< V
Figure 10
Figure
< V
= 10 MHz; GND = 0 V; T
pin I/O
at die
Conditions
pin V
pin CLK
pin RST
pin V
Rev. 3.0. — 17 January 2011
DD(INTF)
DD(INTF)
…continued
DD(INTF)
CC
CC
11,
CC
DD(INTF)
.
DD(INTF)
Figure 13 on page
.
.
TDA8034T; TDA8034AT
Min
-
30
-
−0.3
0.7V
-
-
-
0
0.75V
16
amb
Table 4
DD(INTF)
= 25
DD(INTF)
19; δ = t1 / (t1 + t2).
-15
-
Min
135
−70
−20
90
DD(INTF)
°
for states of pin CLKDIV1.
C; unless otherwise specified.
Typ
-
-
-
-
-
0.14V
-
-
-
-
20
.
Typ
-
175
-
-
120
150
DD(INTF)
Smart card interface
-
0.3
24
Max
100
15
0.3V
V
-
5
5
-
DD(INTF)
-
Max
+15
225
+70
+20
150
© NXP B.V. 2011. All rights reserved.
DD(INTF)
+ 0.3 V
mA
mA
mA
Unit
mA
mA
°C
18 of 29
Unit
Hz
ms
ms
V
V
μA
μA
V
V
kΩ