MCP2140A-I/P Microchip Technology, MCP2140A-I/P Datasheet - Page 46
![IC IRDA CONTROLLR DTE/DCE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
MCP2140A-I/P
Manufacturer Part Number
MCP2140A-I/P
Description
IC IRDA CONTROLLR DTE/DCE 18DIP
Manufacturer
Microchip Technology
Specifications of MCP2140A-I/P
Package / Case
18-DIP (0.300", 7.62mm)
Controller Type
IRDA Standard Protocol Stack Controller
Interface
UART
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
2.2mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
Controller Area Network (CAN)
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Ic Function
Standard Protocol Stack Controller
Brief Features
Includes UART-to-IrDA Standard Encoder/decoder Functionality, Infrared Supported
Supply Voltage Range
2V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP2140DM-TMPSNS - BOARD DEMO FOR MCP2140
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip
Quantity:
73
Part Number:
MCP2140A-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP2140A
DS22050A-page 46
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
E
c
MIN
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
© 2007 Microchip Technology Inc.
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
φ
L