MCP2140A-I/P Microchip Technology, MCP2140A-I/P Datasheet - Page 45
![IC IRDA CONTROLLR DTE/DCE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
MCP2140A-I/P
Manufacturer Part Number
MCP2140A-I/P
Description
IC IRDA CONTROLLR DTE/DCE 18DIP
Manufacturer
Microchip Technology
Specifications of MCP2140A-I/P
Package / Case
18-DIP (0.300", 7.62mm)
Controller Type
IRDA Standard Protocol Stack Controller
Interface
UART
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
2.2mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
Controller Area Network (CAN)
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Ic Function
Standard Protocol Stack Controller
Brief Features
Includes UART-to-IrDA Standard Encoder/decoder Functionality, Infrared Supported
Supply Voltage Range
2V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP2140DM-TMPSNS - BOARD DEMO FOR MCP2140
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip
Quantity:
73
Part Number:
MCP2140A-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
φ
0.10
0.40
0.31
MIN
2.05
0.25
0.20
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
h
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
β
MCP2140A
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS22050A-page 45
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