PKU5311ESI Ericsson Power Modules, PKU5311ESI Datasheet - Page 23

• Manufacturer Part Number: PKU5311ESI
• Description: DC/DC Converters & Regulators 35W 7V OUT 7A 33.02x22.86x7.50 mm
• Manufacturer: Ericsson Power Modules
• Series: PKU-Er

Specifications of PKU5311ESI

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

E
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 8 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
of the solder melting temperature, (T
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Prepared (also subject responsible if other)
MICJAN
Approved
EAB/FJB/GM [Natalie Johansson]
General reflow process specifications
Average ramp-up (T
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
Minimum pin temperature
Max product temperature
Average ramp-down (T
Maximum time 25°C to peak
PKU 5000E series
DC/DC converters, Input 18-72 V, Output up to 10 A/35 W
Temperature
T
L
T
PIN
minimum
PRODUCT
PRODUCT
Time in preheat
T
)
/ soak zone
PRODUCT
Time 25°C to peak
)
L
maximum
T
T
T
L
PIN
PRODUCT
SnPb eutectic
3°C/s max
183°C
30 s
210°C
225°C
6°C/s max
6 minutes
L
, 183°C for Sn63Pb37)
Time in
reflow
L
, 217 to 221°C for
Checked
See §1
PIN
profile
Pb-free
3°C/s max
221°C
30 s
235°C
260°C
6°C/s max
8 minutes
Pin
PIN
) in excess
) in
Product
profile
Time
Ericsson Internal
PRODUCT SPEC.
No.
5/1301-BMR 660 Uen
Date
2008-11-10
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment
and no longer can be considered dry, the modules must be
baked according to J-STD-033.
Thermocoupler Attachment
PRODUCT
) since this will likely be the warmest part of the
PRODUCT
PRODUCT
Pin 8 for measurement of minimum pin
(solder joint) temperature, T
Pin 2 for measurement of maximum product
temperature, T
Technical Specification
EN/LZT 146 391 R4B May 2009
© Ericsson AB
Rev
B
must not exceed 225 °C at any time.
must not exceed 260 °C at any time.
PRODUCT
Reference
PIN
1 (4)
23