VNC1L-1A-REEL FTDI, Future Technology Devices International Ltd, VNC1L-1A-REEL Datasheet - Page 28

IC USB HOST CTLR VINCULUM 48LQFP

VNC1L-1A-REEL

Manufacturer Part Number
VNC1L-1A-REEL
Description
IC USB HOST CTLR VINCULUM 48LQFP
Manufacturer
FTDI, Future Technology Devices International Ltd
Series
Vinculumr
Datasheet

Specifications of VNC1L-1A-REEL

Controller Type
USB 2.0 Controller
Interface
SPI
Voltage - Supply
3 V ~ 3.6 V
Current - Supply
25mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
48-LQFP
For Use With
768-1006 - BOARD DEV FOR VINCULUM VNC1L-1A768-1005 - MOD USB FLASH DISK FILE TRANSFER768-1002 - MOD MCU-USB HOST CTLR 40-DIP768-1001 - MOD MCU-USB HOST CTLR 24-DIP27937 - MEMORY STICK DATALOGGER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
768-1000-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VNC1L-1A-REEL
Manufacturer:
TI
Quantity:
3 485
Part Number:
VNC1L-1A-REEL
Manufacturer:
FTDI
Quantity:
20 000
8.2 Solder Reflow Profile
The recommended solder reflow profile is shown in Figure 8.2.
Figure 8.2 VNC1L Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8.1. Values are shown for both
a completely Pb free solder process (i.e. VNC1L is used with Pb free solder) and for a non-Pb free solder
process (i.e. VNC1L is used with non-Pb free solder).
Table 8.1 Reflow Profile Parameter Value
Profile Feature
Preheat
- Temperature Min (T
- Temperature Max (T
- Time (t
Temperature T
- Temperature (T
- Time (t
Temperature (t
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
Time Maintained Above Critical
Peak Temperature (T
Time within 5°C of actual Peak
Ramp Down Rate
S
L
)
25
Min to t
T
T
p
L
T Max
T Min
S
S
L
P
:
)
L
S
)
Max)
Copyright © 2009 Future Technology Devices International Limited
S
P
S
)
Min.)
Max.)
s
to T
p
Preheat
T = 25º C to T
)
Time, t (seconds)
t
S
Vinculum VNC1L Embedded USB Host Controller IC Datasheet Version 2.02
p
P
Pb Free Solder Process
3°C / second Max.
150°C
200°C
60 to 180 seconds
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
8 minutes Max.
Ramp Up
t
p
t
L
Document Reference No.: FT_000030
Non-Pb Free Solder Process
3°C / second Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
10 to 30 seconds
6°C / second Max.
6 minutes Max.
Ramp
Down
Critical Zone: when
T is in the range
Clearance No.: FTDI# 50
T to T
L
p
28

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