TDA8002CG/C1,518 NXP Semiconductors, TDA8002CG/C1,518 Datasheet - Page 24
TDA8002CG/C1,518
Manufacturer Part Number
TDA8002CG/C1,518
Description
IC INTERFACE CARD 32-LQFP
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8002CGC1518.pdf
(28 pages)
Specifications of TDA8002CG/C1,518
Package / Case
32-LQFP
Controller Type
Smart Card Interface
Interface
Analog
Voltage - Supply
3 V ~ 6.5 V
Current - Supply
140mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3518-2
935261709518
TDA8002CGB-T
935261709518
TDA8002CGB-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8002CG/C1,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
PACKAGE OUTLINES
1999 Oct 12
SO28: plastic small outline package; 28 leads; body width 7.5 mm
IC card interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT136-1
28
1
Z
max.
0.10
2.65
y
A
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E06
IEC
0.01
0.25
A
3
e
0.019
0.014
0.49
0.36
b
D
p
MS-013AE
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
18.1
17.7
0.71
0.69
D
(1)
0.30
0.29
E
7.6
7.4
(1)
b
p
scale
0.050
EIAJ
1.27
24
5
e
15
14
w
0.419
0.394
10.65
10.00
H
M
E
c
0.055
1.4
L
A
10 mm
2
0.043
0.016
A
1.1
0.4
L
1
p
0.043
0.039
1.1
1.0
Q
H
E
PROJECTION
E
detail X
EUROPEAN
0.25
0.01
v
L
L
0.25
0.01
p
Q
w
(A )
Product specification
3
0.004
TDA8002C
0.1
y
A
ISSUE DATE
95-01-24
97-05-22
A
0.035
0.016
Z
0.9
0.4
(1)
X
SOT136-1
v
M
8
0
A
o
o