NE1617DS NXP Semiconductors, NE1617DS Datasheet - Page 5

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NE1617DS

Manufacturer Part Number
NE1617DS
Description
Board Mount Temperature Sensors I2C LOC +/- 2OC AND REM +/- 3OC TS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NE1617DS

Full Temp Accuracy
+/- 3 C, +/- 5 C
Package / Case
SSOP-16
Digital Output - Bus Interface
2-Wire
Maximum Operating Temperature
+ 120 C
Minimum Operating Temperature
0 C
Output Type
Digital
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NE1617DS,112

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1. V
2. V
3. Address is read a power up and at start of conversion for all conversions except the fastest rate.
4. Due to the bias current, any pull-up/down resistors should be
Philips Semiconductors
ELECTRICAL CHARACTERISTICS
V
NOTES:
2004 Oct 06
DD
Temperature resolution
Local temperature error
Local temperature error
Remote temperature error
Remote temperature error
Under voltage lockout
Power-on reset threshold
Power supply current (average)
Power supply current (average)
Power supply current (standby)
Conversion time
Conversion rate error
Remote sensor source current
Remote sensor source current
Address pin bias current
Temperature monitor for microprocessor systems
= 3.3 V; T
DD
DD
(rising edge) voltage below which the ADC is disabled.
(falling edge) voltage below which the logic is reset.
amb
PARAMETER
PARAMETER
= 0 C to +125 C unless otherwise noted.
T
T
T
T
V
V
Conversion rate = 0.25/sec
Conversion rate = 2/sec
SMBus inactive
From stop bit to conversion complete,
both channels
Percentage error in programmed rate
HIGH level
LOW level
Momentary as the address is being read
(Notes 3 and 4)
amb
amb
remote
remote
DD
DD
supply (Note 1)
supply (falling edge) (Note 2)
= +60 C to +100 C
= 0 C to +125 C
= +60 C to +100 C
= 0 C to +125 C
CONDITIONS
CONDITIONS
2 k .
5
MIN.
–30
2.0
1.0
1
LIMITS
TYP.
< 1
< 2
100
160
10
3
Product specification
MAX.
2.95
180
170
+30
2.5
NE1617
70
10
2
3
3
5
UNIT
UNIT
ms
%
V
V
C
C
C
C
C
A
A
A
A
A
A

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