SE95D-T NXP Semiconductors, SE95D-T Datasheet - Page 23
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SE95D-T
Manufacturer Part Number
SE95D-T
Description
Board Mount Temperature Sensors I2C LOCAL +/- 1OC TS
Manufacturer
NXP Semiconductors
Datasheet
1.SE95D118.pdf
(27 pages)
Specifications of SE95D-T
Full Temp Accuracy
+/- 3 C
Package / Case
SOT-96
Digital Output - Bus Interface
2-Wire
Digital Output - Number Of Bits
13 bit
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Output Type
Digital
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
SE95D,118
NXP Semiconductors
SE95_7
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 19.
Table 20.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Ultra high accuracy digital temperature sensor and thermal watchdog
Figure
20
Rev. 07 — 2 September 2009
21.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
21) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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