SE98TK-T NXP Semiconductors, SE98TK-T Datasheet - Page 35

Board Mount Temperature Sensors I2C LOCAL +/- 2OC TS DIMM

SE98TK-T

Manufacturer Part Number
SE98TK-T
Description
Board Mount Temperature Sensors I2C LOCAL +/- 2OC TS DIMM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SE98TK-T

Temperature Threshold
+ 6 C
Full Temp Accuracy
+/- 4 C
Package / Case
SOT-908
Digital Output - Bus Interface
2-Wire, I2C
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 20 C
Output Type
Digital
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
SE98TK,118
NXP Semiconductors
15. Revision history
Table 31.
SE98_4
Product data sheet
Document ID
SE98_4
Modifications:
SE98_3
SE98_2
SE98_1
(9397 750 14649)
Revision history
Release date
20090202
20080404
20080107
20060510
Changed data sheet descriptive title from “SO-DIMM SMBus/I
“DDR memory module temp sensor, 3.3 V”
Section 1 “General
+125 C”
Section 2.2 “Temperature sensor
to “ 40 C to +125 C”
Section 7.3 “EVENT output condition”
Added
Table 7 “Capability register (address 00h) bit
– description of symbol TRES: appended “(11-bit)”
– description of symbol BCAP: changed from “has Alarm and Critical Trips capability” to “has
Table 9 “Configuration register (address 01h) bit
Table 10 “Hysteresis
– added 2 right-most columns “Critical Alarm Window Bit (bit 15)”
– “T
– “T
– “hysteresis” replaced with “T
Section 8.4 “Temperature
Table 25
– changed descriptive line below table title from “T
– symbol T
Table 26 “SMBus DC
“T
Table 27 “SMBus AC
“T
amb
amb
Alarm and Critical Trips interrupt capability”
+125 C”
th(low)
th(high)
= 20 C to +120 C” to “T
= 20 C to +120 C” to “T
Section 7.10 “Hot plugging”
“Characteristics”:
” replaced with “T
” replaced with “T
lim(acc)
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
, condition “T
description”, first sentence: changed from “ 20 C to +125 C” to “ 40 C to
enable”:
characteristics”: changed descriptive line below table title from
characteristics”: changed descriptive line below table title from
Rev. 04 — 2 February 2009
format”: added 4
trip(l)
trip(u)
amb
hys
amb
amb
features”, last bullet item changed from “ 20 C to +125 C”
= 20 C to +125 C” changed to “T
= 40 C to +120 C”
= 40 C to +120 C”
re-written
th
paragraph and
description”:
Change notice
-
-
-
-
description”: description of bit 2, CVO, re-written
DDR memory module temp sensor, 3.3 V
amb
= 20 C to +125 C” to “T
Table 11
2
C-bus temperature sensor” to
Supersedes
SE98_3
SE98_2
SE98_1
-
amb
= 40 C to +125 C”
© NXP B.V. 2009. All rights reserved.
amb
= 40 C to
SE98
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