UDA1341TS/N1,518 NXP Semiconductors, UDA1341TS/N1,518 Datasheet - Page 31

• Manufacturer Part Number: UDA1341TS/N1,518
• Description: IC AUDIO CODEC 20BIT 28SSOP
• Manufacturer: NXP Semiconductors
• Type: Stereo Audior

Specifications of UDA1341TS/N1,518

• Package / Case: 28-SSOP (0.200", 5.30mm Width)
• Data Interface: Serial
• Resolution (bits): 20 b
• Number Of Adcs / Dacs: 4 / 2
• Sigma Delta: Yes
• S/n Ratio, Adcs / Dacs (db) Typ: 97 / 100
• Voltage - Supply, Analog: 2.4 V ~ 3.6 V
• Voltage - Supply, Digital: 2.4 V ~ 3.6 V
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Adc Inputs: 4
• Number Of Dac Outputs: 2
• Conversion Rate: 48 KSPS
• Interface Type: Serial (I2S) or L3
• Resolution: 20 bit
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 4 ADC / 2 DAC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935254530518; UDA1341TSDB-T; UDA1341TSDB-T

NXP Semiconductors
15.5
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2002 May 16
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Economy audio CODEC for MiniDisc (MD)
home stereo and portable applications
from your NXP Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(4)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
(1)
31
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
suitable
suitable
suitable
suitable
suitable
UDA1341TS
Product specification
REFLOW
(2)