UDA1344TS/N2,518 NXP Semiconductors, UDA1344TS/N2,518 Datasheet - Page 24

• Manufacturer Part Number: UDA1344TS/N2,518
• Description: IC STEREO AUDIO CODEC 28SSOP
• Manufacturer: NXP Semiconductors
• Type: Stereo Audior

Specifications of UDA1344TS/N2,518

• Package / Case: 28-SSOP (0.200", 5.30mm Width)
• Data Interface: Serial
• Resolution (bits): 20 b
• Number Of Adcs / Dacs: 2 / 2
• Sigma Delta: Yes
• S/n Ratio, Adcs / Dacs (db) Typ: 95 / 100
• Voltage - Supply, Analog: 2.7 V ~ 3.6 V
• Voltage - Supply, Digital: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Adc Inputs: 2
• Number Of Dac Outputs: 2
• Conversion Rate: 55 KSPS
• Interface Type: Serial (I2S)
• Resolution: 20 bit
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 2 ADC / 2 DAC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935261790518; UDA1344TSDB-T; UDA1344TSDB-T

NXP Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Jun 29
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Low-voltage low-power stereo audio
CODEC with DSP features
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
24
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
UDA1344TS
Product specification
REFLOW
(1)