PCX745BVZFU350LE Atmel, PCX745BVZFU350LE Datasheet - Page 3

• Manufacturer Part Number: PCX745BVZFU350LE
• Description: IC MPU 32BIT 350MHZ 255PBGA
• Manufacturer: Atmel

Specifications of PCX745BVZFU350LE

• Processor Type: PowerPC 32-Bit RISC
• Speed: 350MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 255-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

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2138G–HIREL–05/06
General Parameters
Features
The following list provides a summary of the general parameters of the PC755:
This section summarizes features of the PC755’s implementation of the PowerPC architecture.
Major features of the PC755 are as follows:
Technology
Die size
Transistor count
Logic design
PC745
PC755
Core power supply
I/O power supply
• Branch Processing Unit
• Dispatch Unit
• Decode
• Completion
– Four instructions fetched per clock
– One branch processed per cycle (plus resolving 2 speculations)
– Up to 1 speculative stream in execution, 1 additional speculative stream in fetch
– 512-entry Branch History Table (BHT) for dynamic prediction
– 64-entry, 4-way set associative Branch Target Instruction Cache (BTIC) for
– Full hardware detection of dependencies (resolved in the execution units)
– Dispatch two instructions to six independent units (system, branch, load/store, fixed-
– Serialization control (predispatch, postdispatch, execution serialization)
– Register file access
– Forwarding control
– Partial instruction decode
– 6 entry completion buffer
– Instruction tracking and peak completion of two instructions per cycle
– Completion of instructions in program order while supporting out-of-order instruction
eliminating branch delay slots
point unit 1, fixed-point unit 2, floating-point)
execution, completion serialization and all instruction flow changes
0.22 µm CMOS, five-layer metal, 1 layer poly
6.61 mm x 7.73 mm (51 mm
6.75 million
Fully-static Packages
Surface mount 255 Plastic Ball Grid Array (PBGA)
Surface mount 255 Ceramic Ball Grid Array (Hi-TCE)
Surface mount 360 Plastic Ball Grid Array (PBGA)
Surface mount 360 Ceramic Ball Grid Array (CI-CGA, CBGA, HiTCE)
2V ± 100 mV DC (nominal; some parts support core voltages down to 1.8V;
see
2.5V ± 100 mV DC or 3.3V ± 165 mV DC (input thresholds are configuration
pin selectable)
“Recommended Operating Conditions
2
)
(1)
” on page 16
PC755/745
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